Semiconductor Package Heat Spreader Layout for Warpage Control
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Solution Overview
Problem
The challenge of improving the heat dissipation characteristics of semiconductor packages to enhance the reliability of high-performance semiconductor chips, particularly in reducing warpage and effectively dissipating heat generated by the chips, is not adequately addressed by existing technologies.
Innovation Solution
A semiconductor package design incorporating a lower and upper redistribution structure with posts connecting them, an encapsulant, and a heat dissipation member that overlaps the chip structures, along with a heat transfer material layer and external connection bumps, to facilitate efficient heat dissipation and control warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a semiconductor chip is designed with increased performance, then processing capability is improved, but heat generation increases and reliability deteriorates
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional package substrate and creates a separate, dedicated heat dissipation member. This member is positioned to directly contact the lower surface of the semiconductor chip, allowing heat to be extracted from the chip before it can cause reliability issues, thereby enabling high-performance operation while maintaining reliability.
Solution Approach 2:
The patent introduces a heat transfer member as an intermediary between the semiconductor chip and the heat dissipation member. This intermediary facilitates efficient thermal conduction from the chip to the dissipation structure, enabling effective heat management that supports both high performance and high reliability.
2Temperature
If heat dissipation structures are added to the semiconductor package, then heat dissipation characteristics are improved, but device complexity increases
Solution Approach 1:
The heat dissipation member is designed to serve multiple functions simultaneously: it acts as a thermal management component, a structural support element, and a warpage control mechanism. By integrating these functions into a single component, the patent improves heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The patent employs composite material structures in the heat dissipation member and package substrate, combining materials with different thermal and mechanical properties. This allows the structure to achieve superior heat dissipation performance while maintaining structural integrity and controlling warpage, thereby managing complexity through material optimization rather than structural complexity.
3Stability of the object's composition
If the heat dissipation member overlaps the chip structure, then warpage control is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements local quality by positioning the heat dissipation member to overlap specifically with regions of the chip structure that generate the most heat or are most prone to warpage. This targeted approach provides effective warpage control in critical areas without requiring uniform high-precision manufacturing across the entire package, thereby reducing overall manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and reduces warpage, thereby improving the reliability and performance of semiconductor packages by effectively managing thermal stress and ensuring efficient heat transfer.
Implementation Method 1
a heat dissipation member that is on a first side of the upper chip structure and overlaps at least a portion of the lower chip structure
Implementation Method 2
ensuring efficient heat transfer
Implementation Method 3
a heat transfer material layer between the upper chip structure and the unit package structure
Data Source
AI summary
A semiconductor package includes a lower redistribution structure, a lower chip structure, an encapsulant, an upper redistribution structure, a plurality of posts, an upper chip structure, a heat dissipation member that is on a first side of the upper chip structure and overlaps at least a portion of the lower chip structure in a first direction, and external connection bumps. In plan view, the heat dissipation member includes a first surface, a second surface a third surface and a fourth surface. The second surface of the heat dissipation member faces the first side of the upper chip structure. At least one of the first surface, the third surface, and the fourth surface of the heat dissipation member overlaps an edge of the lower redistribution structure, an edge of the encapsulant, and an edge of the upper redistribution structure in the first direction.