Semiconductor Package Heaters Integrated for Sub-Zero Boot-Up
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Solution Overview
Problem
Integrated circuit (IC) packages face functionality issues and boot-up failures in sub-zero temperatures, as existing solutions like adding heaters to metal portions lead to geometry and cost issues.
Innovation Solution
Integrating a thermal element into chiplets or a package-level interposer, which can be configured to radiate heat and maintain a controlled temperature, enabling operation in sub-zero conditions without affecting board geometry or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heaters are added to metal portions of semiconductor packages, then cold temperature operation is enabled, but geometry issues and board layout tradeoffs occur
Solution Approach 1:
The heater element is merged with an existing die in the semiconductor package, combining the heater function with a processing die rather than being a separate component. This integration eliminates the need for additional board layout considerations and geometry modifications, as the heater is formed within the existing die structure using standard semiconductor fabrication processes
Solution Approach 2:
An existing die in the semiconductor package serves dual functions: as a processing die for its computational or control role, and as a heater element when current is applied to its conductive layers. This multi-functionality allows the same component to provide both logic processing and thermal heating, eliminating the need for dedicated heater components
2Reliability
If thermal elements are integrated into chiplets or interposer, then heat radiation control is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive layers within the die are configured with specific geometric parameters (trace width, spacing, pattern density) to control the amount and distribution of heat radiated. By adjusting these physical parameters of existing conductive structures, the heater provides controlled thermal output without requiring new materials or complex manufacturing processes
Solution Approach 2:
The heater element utilizes the existing conductive layer structure that would normally be present for electrical interconnects, copying the thermal conduction paths already designed into the die. This approach leverages the existing metal traces and diffusion layers as heater elements, avoiding the need to create entirely new thermal management structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable operation of IC packages in extreme temperatures by maintaining a stable operating range, enhancing solder joint reliability and preventing damage from low temperatures.
Implementation Method 1
a heater element configured to radiate heat, within one or more of a metal layer and a diffusion layer
Data Source
AI summary
A semiconductor package comprises two or more dies including at least one integrated circuit. The package can further include a heater element. The heater element can be configured to radiate heat, within one or more of a metal layer and a diffusion layer of at least one of the two or more dies of the semiconductor package. The package can further include controller interface configured to receive a heater enablement signal to initiate or terminate operation of the heater element. Other systems, apparatuses and methods are described.