Electronic Package Heatsink Recess Structure Without Grinding
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Solution Overview
Problem
Existing electronic package manufacturing methods are inefficient and prone to mechanical stress and defects due to the need for grinding to achieve planar uniformity and expose thermally conductive substrates, which can lead to damage and increased processing time.
Innovation Solution
The method involves forming a recess in the package material to expose only a desired portion of the thermally conductive substrate, eliminating the need for grinding and allowing for reduced mechanical stress, improved manufacturability, and unique orientation identification during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a grinding process is used to expose the thermally conductive substrate, then planar uniformity between package material and substrate surface is improved, but manufacturing time increases and mechanical stress causes defects
Solution Approach 1:
The recess is formed in the package material before final assembly, pre-positioning the exposure area for the thermally conductive substrate. This preliminary shaping eliminates the need for subsequent grinding operations to achieve planar uniformity, directly resolving the contradiction between manufacturing precision and productivity
2Manufacturing precision
If a grinding process is used to expose the thermally conductive substrate, then planar uniformity is improved, but mechanical stress increases causing scratches and damage
Solution Approach 1:
The mechanical grinding process is replaced with a recess formation process that exposes the substrate without aggressive material removal. This substitution eliminates mechanical stress-induced defects such as scratches and damage while maintaining planar uniformity, resolving the contradiction between manufacturing precision and reliability
3Reliability
If the substrate is made substantially flat to minimize damage risk, then reliability is improved, but manufacturing flexibility is reduced
Solution Approach 1:
The substrate exposure is segmented into a defined recess area rather than requiring the entire substrate surface to be flat. This segmentation allows different regions to serve different functions - the recessed area for controlled exposure and other areas for varied manufacturing configurations, resolving the contradiction between reliability and adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and improves reliability by minimizing mechanical stress and defects, enabling efficient production of electronic packages with enhanced thermal conductivity and orientation identification.
Implementation Method 1
a thermally conductive second substrate (4) comprising a first portion (4a) and a second portion (4b) integrally connected to the first portion (4a), wherein at least the first portion (4a) among the first and second portion is fixedly attached to the electronic component (6)
Data Source
AI summary
An electronic package and a method for manufacturing the same is provided. The electronic package includes a first substrate, an electronic component arranged on and/or formed in the first substrate, a thermally conductive second substrate including a first portion and a second portion integrally connected to the first portion, and at least the first portion among the first and second portion is fixedly attached to the electronic component, and a package material arranged to encapsulate the electronic component and to at least partially encapsulate the first and second substrate, and the package material includes a recess formed therein that extends up to a surface of the first portion.