Integrated Circuit Package Cooling Channels for Die Hotspots
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Solution Overview
Problem
The challenge in the semiconductor industry is the inefficient heat dissipation in integrated circuit packages, which affects the performance and reliability of electronic devices as they shrink in size.
Innovation Solution
The integration of a lid with coolant fluid channels in the integrated circuit package, which includes top and bottom channels connected to the dies, enhances heat dissipation by allowing coolant fluid to flow close to the hotspots, thereby improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of electronic devices is reduced to meet demand for smaller devices, then device miniaturization is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces a three-dimensional cooling architecture with vertical channels extending through the substrate thickness and lateral channels at different depths, transforming the traditional two-dimensional surface cooling into a multi-dimensional volumetric cooling system. This allows coolant to access heat sources from multiple spatial dimensions, effectively cooling high-density integrated circuits despite reduced device footprint.
Solution Approach 2:
The cooling system implements a nested channel structure where vertical channels penetrate through the substrate and intersect with lateral channels at multiple levels, creating a hierarchical network. The lateral channels are positioned at different depths within the substrate, with shallower channels serving specific regions and deeper channels serving others, forming a nested arrangement that maximizes cooling coverage in limited space.
2Quantity of substance
If more components are integrated into a given area to improve integration density, then integration density is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The cooling system divides the substrate into multiple cooling zones with laterally spaced-apart vertical channels, each serving specific regions. The lateral channels are segmented into multiple levels at different depths, with each level serving different component regions. This segmentation allows targeted cooling of high-density component areas without interfering with other regions.
Solution Approach 2:
The patent extends cooling capacity into the vertical dimension by positioning lateral channels at multiple depth levels within the substrate. This multi-level vertical arrangement provides additional cooling pathways that can handle the thermal load from high integration density without requiring increased lateral space, thus supporting higher component density in the same footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated in the integrated circuit package, enhancing performance and reliability by ensuring efficient thermal management.
Implementation Method 1
the heat generated in the one or more integrated circuit dies may be more effectively dissipated during the operation of the integrated circuit package
Implementation Method 2
coolant fluid channels in the top portion and the bottom portions. The coolant fluid channels in the bottom portions may be connected to coolant fluid channels in the one or more integrated circuit dies
Data Source
AI summary
An integrated circuit package and the method of forming the same are provided. An integrated circuit package may include a first die having a first substrate over a package substrate and a lid. A first channel may extend through the first substrate from a first sidewall of the first die to a second sidewall of the first die. The lid may include a top portion over the first die and a first bottom portion extending along the first sidewall of the first die. The first bottom portion may include a second channel connected to the first channel.