Semiconductor Package Housing Bonding to Prevent Resin Overflow
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Solution Overview
Problem
The existing semiconductor package manufacturing process faces issues with non-uniform mold pressurization, leading to contamination of the substrate due to overflowing molding resin, which affects the stability and heat conductivity of the package.
Innovation Solution
A semiconductor package design where a heat radiation substrate and a housing are separately formed and bonded using an insulating layer or adhesive member, with the housing having a greater thickness than the metal pattern layer and terminals exposed above the housing to facilitate external electrical connections, enhancing heat conductivity and preventing resin overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold presses only edges of the heat release metal layer to form the package housing, then the heat release post is avoided during molding, but the pressurization becomes non-uniform and molding resin overflows into the substrate
Solution Approach 1:
The housing is divided into two separate components: a lower housing formed by molding that covers the substrate, and an upper housing that is separately formed and then bonded to the lower housing. This segmentation allows the molding process to focus on forming the lower housing without the complexity of avoiding the heat release post, while the upper housing can be precisely formed separately and bonded in a controlled manner, preventing resin overflow and substrate contamination.
Solution Approach 2:
An insulating layer is introduced as an intermediary component between the substrate and the housing. This insulating layer serves multiple functions: it provides electrical insulation, acts as a barrier to prevent molding resin from overflowing onto the substrate, and serves as a bonding surface for attaching the upper housing. The intermediary layer thus resolves the contradiction by protecting the substrate during molding while enabling precise housing formation.
2Reliability
If the heat release post is avoided during molding by pressing only edges, then the post structure is preserved, but productivity decreases due to complex molding processes
Solution Approach 1:
The housing formation process is segmented into two stages: first, the lower housing is formed by conventional molding; second, the upper housing is separately formed and bonded. This segmentation simplifies the molding process for each component while maintaining the overall package structure and heat release post integrity, thereby improving productivity without compromising reliability.
Solution Approach 2:
The insulating layer is formed in advance on the substrate before the housing molding process. This preliminary action prepares the surface for subsequent housing attachment and prevents resin overflow during molding, eliminating the need for complex real-time molding adjustments and improving manufacturing efficiency while ensuring package stability.
3Temperature
If various forms and structures of radiation fins are applied to enlarge contact area, then heat conductivity improves, but device complexity increases
Solution Approach 1:
The insulating layer serves multiple functions simultaneously: it provides electrical insulation between the substrate and housing, acts as a barrier to prevent resin overflow, serves as a bonding surface for attaching the upper housing, and provides a platform for mounting radiation fins to enhance heat dissipation. This multi-functionality improves heat rejection rate without significantly increasing device complexity, as a single component accomplishes multiple tasks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves productivity by allowing mass-production of semiconductor packages with enhanced heat conductivity and structural bonding, preventing substrate contamination and ensuring stable molding processes.
Implementation Method 1
a manufacturing process thereof is suitable for mass-production in such a way that a heat radiation substrate and a housing are separately formed and are bonded to each other through an insulating layer or an adhesive member
Data Source
AI summary
Provided is a semiconductor package in which a heat radiation substrate and a housing are separately formed and are bonded to each other through an insulating layer or an adhesive member so that a manufacturing process thereof is suitable for mass-production and thereby, productivity may be increased.