Package Bonding Structure Using Hybrid Bonding Instead of Solder
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in miniaturizing electronic devices is the difficulty in controlling the amount of solder material, leading to issues such as solder cracking and solder bridging, which reduces manufacturing yield and affects the reliability of electronic components.
Innovation Solution
The use of a non-solder joint bonding technique, specifically a hybrid-bond technique, such as copper to copper bonding, to connect the electronic component to the package structure, eliminating the need for solder and preventing solder-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder material is used to bond electronic component and package structure, then bonding is achieved, but solder cracking and solder bridging occur when device size is reduced
Solution Approach 1:
The patent removes solder material from the bonding process entirely, replacing it with a non-solder bonding method. This extraction of the problematic solder material eliminates the root cause of solder cracking and bridging while maintaining the essential bonding function between the electronic component and package structure.
Solution Approach 2:
The patent changes the bonding mechanism from solder-based to a different bonding method (such as direct metal bonding or anisotropic conductive film bonding). This parameter change in the bonding approach allows for precise control without the material control issues inherent in solder application at reduced scales.
2Volume of moving object
If device size is reduced, then miniaturization is achieved, but control of solder material becomes difficult
Solution Approach 1:
By removing solder material from the system, the patent eliminates the need to control solder material quantity and placement precision. This extraction allows device miniaturization to proceed without being constrained by the difficulty of handling and controlling solder material at small scales.
3Ease of manufacture
If solder bonding is used, then component connection is achieved, but manufacturing yield reduces due to solder defects
Solution Approach 1:
The patent converts the harmful effects of solder material (cracking, bridging, yield reduction) into a benefit by completely eliminating solder from the process. This removal transforms the previous problem source into a solution, achieving both ease of manufacture and improved manufacturing yield through non-solder bonding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents solder cracking and bridging, allowing for more precise control over the bonding process, enhancing the reliability and yield of electronic devices by ensuring consistent connections without the limitations of solder material management.
Implementation Method 1
The use of a non-solder joint bonding technique, specifically a hybrid-bond technique, such as copper to copper bonding, to connect the electronic component to the package structure
Data Source
AI summary
An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.