Package-in-Package Hybrid Bonding for Compact Die Stacking

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Solution Overview

Problem

The increasing complexity of integrated circuit packages requires innovative methods to efficiently bond multiple device dies within a single package to enhance functionality while optimizing manufacturing costs and performance.

Innovation Solution

The method involves forming a package by bonding device dies to a wafer through hybrid bonding, followed by singulation and further integration of additional device dies, using techniques such as metal-to-metal and dielectric-to-dielectric bonding, and forming through-vias and redistribution layers to create a stacked package structure that reduces footprint and improves signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple device dies are bonded to the same device die to form a system, then device functionality and performance are enhanced, but package complexity increases

Engineering Contradiction:

Improvedevice functionalityVSAvoidpackage complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements package-in-package formation where one package is integrated within another package structure. This nesting approach allows multiple device dies to be bonded together in a hierarchical manner, with inner packages containing certain dies and outer packages containing additional dies, thereby enhancing functionality while managing complexity through structured organization

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent divides the package structure into multiple separable units or modules that can be independently formed and then integrated. By segmenting the overall package into smaller manageable sections with specific functions, the system achieves enhanced versatility while the modular nature helps manage and reduce overall package complexity

Inventive Principle:

Principle #1Segmentation

2Strength

If device dies are bonded through hybrid bonding techniques, then connection strength and signal transmission are improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveconnection strengthVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent combines multiple bonding techniques (metal-to-metal bonding and dielectric-to-dielectric bonding) into a unified hybrid bonding process. This merging of bonding methods allows the system to achieve both strong mechanical connections and effective signal transmission pathways within a single integrated manufacturing approach, improving connection strength while managing process complexity through consolidation

Inventive Principle:

Principle #5Merging (Combining)

3Speed

If a stacked package structure is formed, then signal transmission efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesignal transmission efficiencyVSAvoidalignment precision

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The patent performs preliminary alignment and bonding operations during the package formation process before final integration. By establishing precise connections between device dies at earlier stages when access is easier and tolerances are more manageable, the system achieves high signal transmission efficiency while reducing the precision demands on final assembly operations

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of compact, high-performance packages with direct die connections, reducing signal transmission bottlenecks and eliminating the need for additional carriers, thereby enhancing the efficiency and performance of integrated circuit packages.

Implementation Method 1

bonding device dies to a wafer to form a first reconstructed wafer

Methodology Applied

Scientific EffectMetal-to-metal bonding: Welding

Implementation Method 2

metal-to-metal and dielectric-to-dielectric bonding

Methodology Applied

Scientific EffectDielectric-to-dielectric bonding:

Implementation Method 3

forming through-vias and redistribution layers to create a stacked package structure that reduces footprint and improves signal transmission

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12074140B2System formed through package-in-package formation

Publication Date: 2024.08.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package includes a first device die, and a second device die bonded to the first device die through hybrid bonding. The second device die is larger than the first device die. A first isolation region encapsulates the first device die therein. The first device die, the second device die, and the first isolation region form parts of a first package. A third device die is bonded to the first package through hybrid bonding. The third device die is larger than the first package. A second isolation region encapsulates the first package therein. The first package, the third device die, and the second isolation region form parts of a second package.