Package-in-Package Hybrid Bonding for Compact Multi-Die Stacking
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Solution Overview
Problem
The increasing complexity of integrated circuit packages requires innovative methods to efficiently bond multiple device dies within a single package to enhance functionality and reduce manufacturing costs while optimizing device performance.
Innovation Solution
The method involves forming a package by bonding device dies to a wafer through hybrid bonding, followed by singulation and further integration of additional device dies, using techniques such as metal-to-metal and dielectric-to-dielectric bonding, and forming through-vias and redistribution layers to create a stacked package structure that reduces footprint and improves signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies are bonded to the same device die to form a system, then device functionality and performance are improved, but package complexity increases
Solution Approach 1:
The patent implements package-in-package formation where a first package containing multiple device dies is bonded to a second device die, creating a nested hierarchical structure. This allows multiple functional units to be integrated while maintaining organized complexity through structured nesting rather than random integration.
Solution Approach 2:
The system is divided into separate functional packages (first package with processing dies, second package with memory dies) that are then integrated. This segmentation allows each package to be optimized independently for its specific function while reducing overall system complexity through modular design.
2Ease of manufacture
If more device dies are packaged in the same package, then manufacturing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
Multiple device dies are bonded to form complete functional packages before the final integration step. This preliminary packaging allows for pre-optimized bonding processes and quality control at the package level, reducing the precision requirements for the final system-level integration.
Solution Approach 2:
The nested package structure enables hierarchical manufacturing where smaller packages are formed and tested independently, then integrated into the final system. This reduces manufacturing precision requirements by breaking down the complex multi-die bonding into manageable sequential steps.
3Speed
If device dies are directly bonded together, then signal transmission is improved, but device heat management becomes more difficult
Solution Approach 1:
Heat management is extracted as a separate concern from signal transmission by incorporating dedicated thermal management structures (heat sinks, thermal vias, heat spreaders) within each package. This allows direct die-to-die bonding for optimal signal transmission while simultaneously addressing heat dissipation through specialized thermal pathways.
4Area of stationary object
If package structure is optimized for compactness, then footprint is reduced, but device die placement flexibility decreases
Solution Approach 1:
The patent transitions from two-dimensional planar packaging to three-dimensional stacked packaging with multiple tiers. Device dies are arranged in vertical stacks with different functional packages at different heights, connected through vertical interconnects. This dimensional change dramatically reduces footprint while providing extensive flexibility in die placement and interconnection routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact, high-performance packages with improved signal transmission and reduced manufacturing costs by allowing direct connections between device dies, eliminating the need for additional carriers and optimizing the placement of computing and application dies.
Implementation Method 1
bonding device dies to a wafer through hybrid bonding
Implementation Method 2
metal-to-metal and dielectric-to-dielectric bonding
Implementation Method 3
forming through-vias and redistribution layers to create a stacked package structure that reduces footprint and improves signal transmission
Data Source
AI summary
A package includes a first device die, and a second device die bonded to the first device die through hybrid bonding. The second device die is larger than the first device die. A first isolation region encapsulates the first device die therein. The first device die, the second device die, and the first isolation region form parts of a first package. A third device die is bonded to the first package through hybrid bonding. The third device die is larger than the first package. A second isolation region encapsulates the first package therein. The first package, the third device die, and the second isolation region form parts of a second package.