Semiconductor Package Impedance Matching With Circuitless Redistribution
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Solution Overview
Problem
The increasing number of input/output connections in semiconductor devices complicates impedance matching, making it difficult to manufacture semiconductor packages with effective electrical performance due to the need for additional circuit layers, which increases the thickness of the semiconductor substrate.
Innovation Solution
A semiconductor package structure incorporating a redistribution structure with a circuitless region and an impedance matching device, including a transformer, to fine-tune circuit impedance, reducing the overall thickness and improving electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of circuit layers is increased to accommodate more I/O connections, then the electrical performance and functionality are improved, but the substrate thickness increases and impedance matching becomes more difficult
Solution Approach 1:
The patent introduces a redistribution structure that routes signals in three dimensions, using vertical vias and multiple routing layers to achieve fan-out connections without proportionally increasing substrate thickness. This allows more I/O connections to be accommodated by utilizing spatial distribution in multiple dimensions rather than simply adding more horizontal circuit layers.
Solution Approach 2:
The patent employs an impedance matching device as an intermediary component between the signal source and the redistribution structure. This device includes adjustable impedance matching circuits that mediate the impedance transitions, enabling effective signal transmission despite the complex multi-layer routing and reduced substrate thickness.
2Reliability
If the number of circuit layers is increased to accommodate more I/O connections, then the electrical performance is improved, but the impedance matching operation becomes more difficult
Solution Approach 1:
The patent introduces an impedance matching device as an intermediary component that simplifies the overall impedance matching operation. This device includes adjustable impedance matching circuits positioned between the signal source and the redistribution structure, making impedance control more manageable despite the complex multi-layer routing.
Solution Approach 2:
The impedance matching circuits within the impedance matching device are designed to be adjustable, allowing dynamic optimization of impedance matching for different signal frequencies and loading conditions. This dynamic capability simplifies the impedance matching operation across varying electrical performance requirements.
Data Source
AI summary
A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.