Package-in-Package IC with Known-Good Base Testing

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Solution Overview

Problem

Current semiconductor package stacking methods result in lower yields due to premature die failures and inefficiencies, particularly in smaller and more complex electronic devices, where increased demands for smaller packages and cost savings are critical.

Innovation Solution

The method involves forming a base package by mounting an integrated circuit on a substrate, encapsulating it with a molding compound, testing for reliability, attaching a bare die, electrically connecting it, and further encapsulating to create a package-in-package structure, which simplifies assembly and improves yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple dies are stacked in a single package, then package size is reduced, but manufacturing yield decreases due to premature die failures

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing yield

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The base package is tested and verified as 'known good' before the bare die is attached to it. This preliminary testing ensures that any failures are detected early in the manufacturing process, preventing premature die failures from occurring during or after assembly, thereby maintaining high manufacturing yield while enabling package stacking

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The packaging process is divided into separate stages: first packaging and testing the base package, then attaching and wire bonding the bare die, and finally encapsulating. This segmentation allows for intermediate testing and quality control at each stage, ensuring reliability while achieving compact stacked packaging

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If conventional die stacking methods are used, then assembly is simplified, but reliability decreases due to premature die failures

Engineering Contradiction:

Improveassembly simplicityVSAvoiddie failure rate

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The base package undergoes complete testing and verification as 'known good' before the bare die is attached. This preliminary action ensures that reliability issues are caught early, preventing premature die failures while maintaining the simplicity of the assembly process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Testing is performed at intermediate stages to provide feedback on package quality. The base package is tested before die attachment, and the final package is tested after encapsulation. This feedback mechanism ensures reliability by detecting and correcting issues early in the manufacturing process

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS8120156B2Integrated circuit package system with die on base package

Publication Date: 2012.02.21 STATS CHIPPAC LTD

AI summary

The present invention provides an integrated circuit package system with die on base package comprising forming a base package comprising, forming a substrate, mounting a first integrated circuit on the substrate, encapsulating the integrated circuit and the substrate with a molding compound, and testing the base package, attaching a bare die to the base package, connecting electrically the bare die to the substrate and encapsulating the bare die and the base package.