Package-in-Package Semiconductor Layout for Heat and Die Balance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently dissipating heat and achieving balanced electrical connections among multiple semiconductor die, leading to suboptimal thermal and electrical performance.
Innovation Solution
The implementation of a semiconductor package design that includes two or more die coupled to a metal layer at their drain, with a first interconnect layer at their source and a second interconnect layer at their gate, encapsulated by an encapsulant, and coupled to a substrate or leadframe, utilizing copper vias and clips for improved heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple semiconductor die are packaged in a conventional manner, then the package can accommodate multiple die, but the thermal resistance is high and heat dissipation is inefficient
Solution Approach 1:
The patent transitions from a planar package layout to a three-dimensional stacked configuration where semiconductor die are arranged vertically above a substrate. This vertical stacking enables heat to be dissipated through the substrate in a direction perpendicular to the original package plane, effectively adding a thermal management dimension that reduces thermal resistance and improves heat dissipation efficiency.
Solution Approach 2:
The package structure is segmented into distinct functional layers: a substrate for heat dissipation, interconnect layers for electrical connections, and encapsulant for protection. This segmentation allows each layer to be optimized independently - the substrate for thermal management, the interconnects for electrical performance, and the encapsulant for mechanical protection - thereby resolving the contradiction between thermal resistance and heat dissipation efficiency.
2Volume of moving object
If multiple semiconductor die are packaged closely together, then the package size is reduced, but achieving balanced electrical connections among die becomes difficult
Solution Approach 1:
The patent uses vertical stacking to reduce the lateral footprint of the package while maintaining electrical connection integrity. By arranging die vertically above the substrate and using multiple interconnect layers, the design achieves compact packaging without compromising the balanced electrical connections that would be difficult to obtain in a densely packed planar configuration.
Solution Approach 2:
Interconnect layers serve as intermediaries between the semiconductor die and the substrate, providing controlled electrical pathways. These interconnect layers enable balanced electrical connections by distributing signals and power uniformly across multiple die in the stacked configuration, thereby maintaining electrical connection reliability while achieving compact package dimensions.
3Ease of manufacture
If conventional packaging methods are used, then the manufacturing process is simple, but thermal and electrical performance are suboptimal
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming the substrate with heat dissipation structures, depositing interconnect layers with specific patterns, placing die in vertical positions, and encapsulating the structure. This segmentation allows each manufacturing step to be optimized independently, achieving superior thermal and electrical performance through specialized processing while maintaining overall manufacturing feasibility.
Solution Approach 2:
The patent employs parameter changes in the manufacturing process, such as controlling the thickness and material composition of interconnect layers, adjusting the vertical spacing between die, and selecting encapsulant materials with specific thermal conductivity. These parameter optimizations enable the package to achieve enhanced thermal and electrical performance while remaining manufacturable through controlled process variations.
Data Source
AI summary
Implementations of a semiconductor package may include two or more die, each of the two more die coupled to a metal layer at a drain of each of the two more die, the two or more die and each metal layer arranged in two parallel planes; a first interconnect layer coupled at a source of each of the two more die; a second interconnect layer coupled to a gate of each of the two or more die and to a gate package contact through one or more vias; and an encapsulant that encapsulates the two or more die and at least a portion of the first interconnect layer, each metal layer, and the second interconnect layer.