Package-in-Package Semiconductor System with Exposed Lead Interconnects
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Solution Overview
Problem
The electronics industry faces challenges in manufacturing smaller, thinner, and more functional semiconductor packages with higher reliability and lower costs, as conventional methods struggle to efficiently pack more integrated circuits into smaller footprints while maintaining performance and reducing manufacturing costs.
Innovation Solution
The integrated circuit package-in-package system connects two integrated circuit dies to a lead frame, with an inner encapsulation covering one die and a package encapsulation exposing the leads as external interconnects, eliminating electrical discontinuities and reducing the need for additional signal redistribution structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages use molded resin encapsulation with lead frames, then manufacturing processes are well-established, but the packages cannot be made smaller and thinner while increasing packaging density
Solution Approach 1:
The patent implements package-in-package configuration where a first semiconductor die is encapsulated in an inner mold compound, and a second semiconductor die is mounted on top of this inner package. This nested structure allows multiple functional units to be stacked vertically, reducing the overall footprint area while maintaining high packaging density. The inner package serves as a substrate for mounting the outer package, creating a compact three-dimensional arrangement.
Solution Approach 2:
The invention transitions from conventional two-dimensional lateral arrangement of packages to three-dimensional vertical stacking. By utilizing the vertical dimension (z-axis) through package-in-package configuration, the design achieves higher packaging density without increasing the planar footprint, thereby enabling smaller and thinner package profiles while accommodating more functional units.
2Device complexity
If the number of devices is decreased to advance technology generations, then manufacturing becomes simpler, but functionality increases requiring more complex packaging
Solution Approach 1:
The patent divides the semiconductor system into multiple independent functional units (first and second semiconductor dies, each with their own circuitry). Each die can be fabricated using standard processes and then integrated into the package-in-package structure. This segmentation allows independent optimization of each functional unit while maintaining overall system functionality, balancing manufacturing simplicity with functional versatility.
Solution Approach 2:
The lead frame structure serves multiple functions: it provides mechanical support for mounting semiconductor dies, establishes electrical connections between dies and external circuits, and acts as a substrate for the package-in-package configuration. This multi-functionality reduces the need for additional specialized components, maintaining manufacturing simplicity while achieving enhanced functionality through integrated design.
3Reliability
If leads are used as external interconnects, then electrical performance improves and manufacturing costs decrease, but additional signal redistribution structures are eliminated
Solution Approach 1:
The lead frame is designed to serve itself by directly providing external interconnection functions without requiring separate signal redistribution structures. The leads extend from the lead frame and make direct electrical contact with bonding pads on semiconductor dies, establishing signal paths without intermediate redistribution layers. This self-service approach simplifies the overall structure, reduces manufacturing steps, and improves electrical performance by minimizing signal path complexity.
Data Source
AI summary
An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.