Package-in-Package Hybrid Bonding for Reduced Footprint
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Solution Overview
Problem
The increasing complexity of integrated circuit packages requires innovative methods to efficiently bond and stack device dies within a package structure, optimizing device performance while minimizing manufacturing costs and footprint.
Innovation Solution
A method involving hybrid bonding of device dies to wafers, followed by singulation and further bonding processes, utilizing metal-to-metal and dielectric-to-dielectric bonding, along with through-vias and redistribution layers to form a package structure that allows for direct connections between dies, reducing thickness and improving signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If device dies are bonded to the same package to achieve more functions, then the device performance and functionality are improved, but the package complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements package-in-package formation where a first package is bonded to a second package, creating a nested structure. The first package contains first device dies, while the second package contains second device dies, and these packages are stacked together through hybrid bonding. This nesting approach allows multiple functional devices to be integrated in a compact arrangement, improving versatility while managing complexity through modular packaging.
Solution Approach 2:
The patent divides the integrated circuit system into separate packages, each containing specific device dies with particular functions. By segmenting the overall system into modular packages that can be independently manufactured and then bonded together, the patent enables functional integration while maintaining manageable complexity at each package level.
2Area of moving object
If multiple device dies are stacked in the same package, then the package footprint is reduced, but the bonding and manufacturing process becomes more difficult
Solution Approach 1:
The patent stacks packages vertically in a nested configuration, placing the first package on top of or beside the second package. This three-dimensional arrangement significantly reduces the horizontal footprint of the integrated circuit system while maintaining ease of manufacture through standardized hybrid bonding processes between packages.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of device dies to a three-dimensional stacked package configuration. By utilizing the vertical dimension for package stacking, the patent reduces the horizontal footprint while maintaining manufacturability through established hybrid bonding techniques.
3Reliability
If direct connections between device dies are implemented, then signal transmission performance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent introduces hybrid bonding as an intermediary process between packages, which includes both metal-to-metal bonding and dielectric-to-dielectric bonding. This hybrid approach provides robust alignment tolerances and reliable electrical connections, achieving good signal transmission performance while maintaining reasonable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient stacking of device dies, reducing package footprint, enhancing signal transmission performance, and eliminating the need for additional carriers, thereby improving the overall performance and efficiency of the package structure.
Implementation Method 1
bonding device dies to a wafer to form a first reconstructed wafer... bonding the first package to a second wafer... metal-to-metal bonding
Implementation Method 2
a first surface dielectric layer of the first device die is bonded to a second surface dielectric layer of the second device die through fusion bonding
Implementation Method 3
utilizing metal-to-metal and dielectric-to-dielectric bonding, along with through-vias and redistribution layers to form a package structure that allows for direct connections between dies
Data Source
AI summary
A package includes a first device die, and a second device die bonded to the first device die through hybrid bonding. The second device die is larger than the first device die. A first isolation region encapsulates the first device die therein. The first device die, the second device die, and the first isolation region form parts of a first package. A third device die is bonded to the first package through hybrid bonding. The third device die is larger than the first package. A second isolation region encapsulates the first package therein. The first package, the third device die, and the second isolation region form parts of a second package.