Package Substrate Inductor Layout With Vertical Coaxial Lines
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Solution Overview
Problem
Current inductor designs for package substrates have performance drawbacks, such as limited inductance and increased area usage, which hinder scalability and efficiency in applications like power delivery.
Innovation Solution
The design incorporates a first and second coaxial line vertically through a core layer with an interconnect surrounded by magnetic segments, including a third magnetic segment covering the interconnect, to enhance inductance without increasing area, achieving improved inductance proportional to the square of the number of turns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional inductor designs are used in package substrates, then the inductor can be implemented with simple structure, but the inductance is limited and area usage increases
Solution Approach 1:
The patent transitions from planar inductor designs to three-dimensional coaxial inductor structures that extend vertically through multiple substrate layers. The coaxial lines and magnetic segments are arranged in the vertical dimension, allowing inductance to scale with the square of the number of turns while occupying reduced planar area.
Solution Approach 2:
The patent employs composite structures combining conductive coaxial lines with magnetic material segments. The magnetic segments (including ferrite or ferromagnetic materials) are integrated with the coaxial line structure to enhance inductance density, creating a composite inductor that achieves higher performance per unit area.
2Reliability
If more turns are added to increase inductance, then inductance increases linearly, but area occupancy increases proportionally
Solution Approach 1:
By arranging inductor turns in the vertical dimension rather than expanding horizontally, the patent enables inductance to increase with the square of the number of turns. Multiple coaxial lines are stacked vertically through the substrate, allowing compact high-inductance designs without proportional area increase.
3Area of stationary object
If inductor area is reduced for better scalability, then area occupancy decreases, but inductance performance deteriorates
Solution Approach 1:
The integration of magnetic segments with the coaxial line structure creates a composite inductor that achieves high inductance density. The magnetic materials concentrate and enhance the magnetic flux, allowing reduced planar area while maintaining or improving inductance performance.
Solution Approach 2:
The vertical stacking of coaxial lines and magnetic segments through the substrate enables compact footprints. By utilizing the third dimension, the patent achieves high inductance values in small planar areas, resolving the trade-off between size and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in higher overall inductance with reduced area occupancy, enabling better scalability and performance in integrated circuit packages.
Implementation Method 1
A magnetic segment may surround the interconnect so that the overall inductance of the inductor can be improved
Implementation Method 2
an inductor may include a first coaxial line and a second coaxial line vertically through a core layer of a package substrate, and an interconnect within the package substrate coupling the first coaxial line and the second coaxial line
Data Source
AI summary
Embodiments herein describe techniques for a semiconductor device including a package substrate having a core layer. An inductor may include a first coaxial line and a second coaxial line vertically through the core layer, and an interconnect within the package substrate coupling the first coaxial line and the second coaxial line. A first magnetic segment may surround the first coaxial line within the core layer, and a second magnetic segment may surround the second coaxial line within the core layer. In addition, a third magnetic segment may surround the interconnect and be coupled to the first magnetic segment and the second magnetic segment. Other embodiments may be described and/or claimed.