Package Inner Shield Groove Design for EMI Reduction
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Solution Overview
Problem
Conventional packages suffer from high electromagnetic interference and low electromagnetic compatibility due to the absence of a shield between electrical elements, leading to inefficient signal shielding.
Innovation Solution
A package design incorporating an inner shield electrically connected to grounding solder pads and a conformal shield, with a molding compound featuring grooves for the inner shield, which reduces electromagnetic interference and enhances compatibility by isolating electrical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If no shield is placed between electrical elements, then the package structure is simple, but electromagnetic interference increases and electromagnetic compatibility decreases
Solution Approach 1:
The package is segmented into multiple shielding layers: an inner shield positioned between electrical elements to provide localized electromagnetic isolation, and an outer conformal shield covering the entire package. This segmentation allows targeted electromagnetic interference protection without requiring a complete shielding enclosure, balancing complexity and effectiveness.
Solution Approach 2:
The inner shield is nested within the molding compound that encapsulates the electrical elements, while the conformal shield is nested over the entire package structure. This nested arrangement provides multi-level electromagnetic protection where each shield operates at different spatial levels, maximizing shielding effectiveness within constrained package dimensions.
2Object-affected harmful factors
If an inner shield is added between electrical elements, then electromagnetic compatibility improves, but device complexity increases
Solution Approach 1:
The inner shield structure is merged with the molding compound by positioning the shield within grooves or cavities formed in the molding material. This integration allows the shield to be part of the encapsulation structure itself, reducing the need for separate shielding components and simplifying the overall manufacturing process.
Solution Approach 2:
The molding compound serves multiple functions: it encapsulates the electrical elements for mechanical protection, provides structural support, and simultaneously houses the inner shield for electromagnetic protection. This multi-functionality reduces the total component count and simplifies the package structure while maintaining electromagnetic compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inner shield effectively reduces electromagnetic interference and increases electromagnetic compatibility, allowing for the integration of various functional elements to minimize product size.
Implementation Method 1
The inner shield is disposed in the groove, and electrically connected to the grounding solder pad. The conformal shield covers the molding compound and the side surface of the substrate, and is electrically connected to the grounding metal layer and the inner shield.
Data Source
AI summary
The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield. Therefore, the inner shield enables the electrical elements to have low electromagnetic interference and high electromagnetic compatibility.