Electronic Package Structure With Reinforced Insulation Support
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Solution Overview
Problem
Conventional electronic packages face issues with dielectric layers cracking under the pressure of electronic structures, leading to poor process yield due to the inability of the circuit layer to withstand the stress.
Innovation Solution
Incorporating a reinforced insulation portion with a higher hardness and different Young's modulus than the dielectric layer, positioned between the dielectric layer and conductive structures, to support and disperse the pressure applied by electronic structures, thereby preventing cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the dielectric layer is used to support electronic structures, then the electronic package structure is simplified, but the dielectric layer cracks under pressure leading to poor process yield
Solution Approach 1:
The patent introduces a carrier with a metal layer as an intermediary support structure between the dielectric layer and electronic structures. The metal layer acts as a mediator that bears the mechanical pressure, preventing direct stress transmission to the dielectric layer and eliminating cracking issues while maintaining structural simplicity
Solution Approach 2:
The carrier and metal layer are prepared in advance before the dielectric layer is formed. This preliminary preparation of the support structure ensures that the dielectric layer is deposited on a pre-established, mechanically robust foundation that can withstand subsequent processing pressures
2Ease of manufacture
If the dielectric layer directly supports conductive structures, then the manufacturing process is simplified, but the circuit layer cracks under stress
Solution Approach 1:
The metal layer serves as an intermediary between the dielectric layer and conductive structures, providing mechanical strength and stress resistance. This mediator allows the manufacturing process to remain simple while the metal layer absorbs the stress that would otherwise crack the circuit layer
Solution Approach 2:
The patent creates a composite structure combining the dielectric layer, metal layer, and conductive structures. This composite material system integrates the electrical insulation properties of the dielectric with the mechanical strength of the metal, achieving both ease of manufacture and stress resistance
3Strength
If a reinforced insulation portion with higher hardness is added, then cracking is prevented, but the device complexity increases
Solution Approach 1:
The reinforced insulation portion acts as a localized intermediary element positioned between the dielectric layer and conductive structures. This mediator provides crack resistance through its higher hardness and different Young's modulus, while its targeted placement minimizes overall structural complexity
Solution Approach 2:
The reinforced insulation portion is strategically positioned only where stress concentration and cracking risk occur, rather than uniformly throughout the structure. This local enhancement of material properties provides crack resistance where needed while maintaining simplicity in other areas
Data Source
AI summary
An electronic package is provided, in which a conductive structure and a reinforced insulation portion are bonded to a dielectric layer, and the reinforced insulation portion is in contact with and abuts against the conductive structure, such that the reinforced insulation portion can support the conductive structure to prevent the conductive structure from cracking when an electronic structure is disposed on the dielectric layer and electrically connected to the conductive structure.