Package-Integrated Antennas for Millimeter-Wave Beamforming
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Solution Overview
Problem
Existing integrated devices with board-mounted or die-integrated antennas face challenges in providing adequate wireless communication at millimeter wavelength ranges due to space constraints and complexity, as well as difficulties in achieving desirable beamforming and directional capabilities.
Innovation Solution
The integration of antennas within packaged integrated device structures, utilizing packaging techniques to define antennas with various shapes, sizes, and orientations, which enables wireless communication over a wide range of wavelengths and improves signal pathways for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If board-mounted antennas or die-integrated antennas are used, then antenna integration is achieved, but adequate wireless communication at millimeter wavelength ranges cannot be provided
Solution Approach 1:
The patent transitions from traditional two-dimensional board-mounted antennas or die-integrated antennas to a three-dimensional package-integrated antenna structure. The antenna is formed within the package cavity using the base and side walls, utilizing the vertical dimension and internal volume to create effective millimeter wavelength radiation patterns that cannot be achieved with planar configurations.
Solution Approach 2:
The package structure serves multiple functions: it protects the integrated device die, provides mechanical support, and simultaneously acts as the antenna structure itself. The base and side walls that form the package housing also constitute the radiating elements and ground plane, eliminating the need for separate antenna components.
2Device complexity
If traditional antenna integration methods are used, then antenna functionality is provided, but system complexity increases and beamforming capabilities are limited
Solution Approach 1:
The patent merges the package housing structure with the antenna structure. The base serves as the ground plane, the side walls form the radiating elements, and the cavity provides the antenna enclosure. This integration reduces the number of discrete components and simplifies the overall system architecture while enabling advanced beamforming through the three-dimensional geometry.
3Area of stationary object
If antennas are integrated on the system board or within the die, then antenna integration is achieved, but space constraints and complexity increase
Solution Approach 1:
The antenna structure is nested within the package cavity, utilizing the internal volume of the package housing. The radiating elements are formed by the side walls themselves, and the ground plane is provided by the base, creating a compact three-dimensional antenna structure that fits within the existing package footprint without requiring additional board space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient wireless communication at millimeter wavelength ranges, reduces system complexity, and enhances beamforming capabilities, making it suitable for high-frequency applications.
Implementation Method 1
a radiating element disposed along the side wall of the package body, wherein the radiating element comprises a portion parallel with the side wall and a curved portion extending outwardly from the portion parallel to the side wall
Implementation Method 2
a grounded element disposed along the side wall of the package body, wherein the grounded element is and positioned between the radiating element and the integrated device die
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.