Electronic Package Interconnect Structure for Dielectric Expansion
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Solution Overview
Problem
The expansion of dielectric layers in electronic packages can lead to fractures or breaks in conductive posts or bumps, causing abnormal opening profiles and incomplete formation, which affects the reliability of electrical connections.
Innovation Solution
Incorporating a conductive element between the pad and the bump within the dielectric layer's opening to mitigate shrinkage and elongate the electrical path, thereby preventing fractures and enhancing connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of the opening of the dielectric layer for the conductive post or bump is reduced, then the integration density is improved, but the profile of the opening becomes abnormal and the conductive post or bump may not be formed completely
Solution Approach 1:
A conductive element is introduced as an intermediary component between the pad and the bump. This conductive element fills the opening in the dielectric layer and provides a stable electrical connection path, mediating the connection between the pad and bump while compensating for the abnormal opening profile caused by dielectric layer expansion.
2Stability of the object's composition
If the dielectric layer expands, then the encapsulation is improved, but the conductive post or bump may be fractured or broken
Solution Approach 1:
The conductive element is placed in advance within the opening to provide a cushioning effect. When the dielectric layer expands, the conductive element absorbs the expansion stress and prevents direct transmission of stress to the conductive post or bump, thereby preventing fractures before they occur.
Solution Approach 2:
The conductive element serves as a stress-absorbing intermediary between the expanding dielectric layer and the conductive post/bump, protecting the conductive post from fracture by mediating the mechanical stress.
3Device complexity
If the electrical path is shortened, then the manufacturing process is simplified, but the reliability of electrical connection deteriorates due to shrinkage from dielectric expansion
Solution Approach 1:
The electrical path is segmented into multiple components: the pad, the conductive element, and the bump. This segmentation allows the conductive element to specifically address the reliability issue by providing a stable connection point that compensates for dielectric expansion, while the overall structure remains relatively simple.
Data Source
AI summary
An electronic package includes a pad, a dielectric layer, a bump, and a conductive element. The dielectric layer encapsulates the pad and includes an opening exposing the pad. The bump is disposed over the pad. The conductive element is disposed in the opening between the pad and the bump. The conductive element is configured to mitigate a shrinkage of an electrical path between the pad and the bump occupied by an expansion of the dielectric layer.