Semiconductor Package Interconnect Layout Without Substrate Cavities
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Solution Overview
Problem
Conventional semiconductor packaging technologies, such as EMIB, require cavities in BGA laminated substrates to accommodate interconnection bridges of varying sizes, leading to high manufacturing costs.
Innovation Solution
A method of forming a semiconductor package involves attaching an interconnect device to a semiconductor substrate and flip-chip mounting chips with conductive bumps of different heights onto the interconnect device and substrate, using a hybrid bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If EMIB packaging technology is used to achieve high-density interconnection, then interconnection density is improved, but manufacturing cost increases due to the need for cavities in BGA laminated substrates
Solution Approach 1:
The patent extracts the interconnection bridge from the conventional BGA laminated substrate structure by introducing a separate carrier substrate. The interconnection bridge is mounted on the carrier substrate which then attaches to the semiconductor substrate, eliminating the need to form cavities in the BGA laminated substrate. This separation of functions reduces manufacturing complexity and cost while maintaining high interconnection density.
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary component between the interconnection bridge and the semiconductor substrate. This carrier substrate serves as a mediator that holds the interconnection bridge and facilitates its attachment to the semiconductor substrate without requiring cavity formation in the BGA laminated substrate, thereby simplifying the manufacturing process.
2Adaptability or versatility
If cavities are formed in BGA laminated substrate to accommodate interconnection bridges, then interconnection function is achieved, but device complexity increases
Solution Approach 1:
The patent segments the interconnection system into distinct functional components: the interconnection bridge, the carrier substrate, and the semiconductor substrate. This segmentation allows each component to be optimized independently and assembled through standardized attachment processes, reducing the overall structural complexity compared to forming cavities within the BGA laminated substrate.
Solution Approach 2:
The carrier substrate acts as an intermediary that simplifies the overall device structure by providing a dedicated platform for the interconnection bridge. This mediator approach eliminates the need for complex cavity formation and integration within the BGA laminated substrate, thereby reducing device complexity while maintaining interconnection functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density interconnection within the semiconductor package while reducing manufacturing costs by eliminating the need for cavities in the substrate.
Implementation Method 1
attaching the interconnect device to a semiconductor substrate; and flip-chip mounting at least two chips over the interconnect device and the semiconductor substrate... attaching the interconnect device to a surface of the semiconductor substrate using a hybrid bonding process
Data Source
AI summary
The present disclosure provides a method for forming a semiconductor package and the semiconductor package. The method comprises attaching an interconnect device to a semiconductor substrate, and flip-chip mounting at least two chips over the interconnect device and the semiconductor substrate. Each chip includes first conductive bumps of a first height and second conductive bumps of a second height formed on a front side hereof, the second height being greater than the first height. The method further comprises bonding the second conductive bumps of each of the at least two chips to the upper surface of the semiconductor substrate while bonding the first conductive bumps of each of the at least two chips to the upper surface of the interconnect device Thus, the method uses a relatively simple and low-cost packaging process to achieve high-density interconnection wiring in a package.