Package Electrical Interconnection Bridge Design
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Solution Overview
Problem
The challenge is to reduce the size and thickness of electronic devices while increasing their functional capabilities, which requires more semiconductor die to be packed in a smaller area, and to minimize the number of electrical connections within these devices.
Innovation Solution
The solution involves creating electrical interconnection bridges within a package by filling openings that expose contacts of semiconductor die with a conductive material, either solder or other conductive materials, to couple the die directly, reducing the need for external connections and allowing for more complex functions in a compact form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more semiconductor die are packed in a smaller area to increase functional capabilities, then the functional complexity increases, but the area available for mounting packages is reduced
Solution Approach 1:
Multiple semiconductor die are combined within a single package substrate, with conductive material forming interconnection bridges between them. This merging approach allows multiple functional die to occupy a consolidated space rather than requiring separate package mounting areas, thereby increasing functional capabilities while reducing the total area required.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional integration by forming conductive interconnection bridges that extend vertically through the substrate. This dimensional change enables die to be stacked or arranged in multiple layers, effectively utilizing vertical space to increase functional density without proportionally increasing the footprint area.
2Length of stationary object
If the number of packages is reduced to decrease device profile, then the device thickness is reduced, but the number of electrical connections required increases
Solution Approach 1:
Multiple die are integrated within a single package with internal conductive interconnections, eliminating the need for separate packages and their associated external connection points. This consolidation reduces the overall device profile while the internal bridge structure manages electrical connections more efficiently than multiple discrete packages would require.
Solution Approach 2:
Conductive material forms intermediary interconnection bridges between die contacts, serving as internal connection pathways that replace external wiring. These intermediary structures are embedded within the package substrate, reducing the need for complex external electrical connections and simplifying the overall connection architecture.
3Device complexity
If external electrical connections are minimized to reduce device complexity, then the number of connections is reduced, but the robustness of interconnections may be compromised
Solution Approach 1:
The conductive interconnection bridges are formed with curved or angled pathways through the substrate rather than straight vertical connections. This curved geometry provides mechanical stress relief and thermal expansion accommodation, enhancing the robustness of interconnections while maintaining a compact internal structure that reduces overall device complexity.
Solution Approach 2:
The package utilizes composite construction with conductive material embedded within an insulating substrate matrix. This composite structure provides both electrical connectivity and mechanical support, ensuring robust interconnections between die while maintaining electrical isolation. The composite nature allows for optimized connection pathways that enhance reliability without increasing external connection complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables thinner, more functional electronic devices with reduced external connections, allowing for more complex functions in a smaller footprint and increased robustness of interconnections, while maintaining the device's height and reducing the number of packages needed.
Implementation Method 1
The conductive material is positioned within the opening to couple the contacts of the first die to the contacts to the second die. The openings and the conductive material form electrical interconnection bridges between the contacts of the first die and the contacts of the second die.
Implementation Method 2
The openings may be formed in the packages using a laser, such that the doped conductive material in the molding compound melts and coats sidewalls of the openings.
Data Source
AI summary
The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.