Semiconductor Package Inter-layer Film Adhesion
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving reliable and efficient redistribution circuit structures for 3D packaging and 3DIC devices, particularly in ensuring strong adhesion between conductive layers and dielectric materials, which leads to delamination issues and reduced yield.
Innovation Solution
The implementation of an inter-layer film made from a copper complex of an imidazole derivative, which forms a three-dimensional network structure between conductive vias and dielectric layers, enhancing adhesive strength and reducing delamination by acting as a copper diffusion barrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional packaging technologies are used without inter-layer film, then manufacturing process is simpler, but adhesion between conductive layers and dielectric materials is poor leading to delamination
Solution Approach 1:
An inter-layer film comprising a copper complex of an imidazole derivative is introduced between the conductive via and the dielectric layer. This inter-layer film acts as a mediator that significantly improves adhesion between the conductive layer and dielectric material, preventing delamination issues while maintaining manufacturing feasibility.
Solution Approach 2:
The inter-layer film is formed as a composite structure containing a copper complex of an imidazole derivative, combining copper conductive material with imidazole ligand molecules. This composite material provides both electrical conductivity and enhanced adhesive properties, resolving the contradiction between structural simplicity and adhesion strength.
2Reliability
If conventional packaging without copper diffusion barrier is used, then manufacturing is easier, but copper diffusion occurs reducing yield
Solution Approach 1:
The inter-layer film serves dual functions: it provides adhesive bonding and acts as a copper diffusion barrier. The imidazole derivative molecules in the film create a protective interface that prevents copper atoms from diffusing into the dielectric layer, thereby improving reliability and yield without adding significant manufacturing complexity.
3Strength
If strong adhesion is achieved through conventional means, then delamination is reduced, but copper diffusion into dielectric layers increases
Solution Approach 1:
The copper complex of imidazole derivative creates a composite material where copper atoms are coordinated with imidazole ligands. This coordination structure provides strong adhesion to dielectric materials while simultaneously confining copper atoms in a stable complex, preventing their diffusion into surrounding dielectric layers. The composite structure resolves the contradiction between achieving strong adhesion and preventing copper diffusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves the adhesion between conductive and dielectric layers, reducing delamination and increasing the reliability and yield of semiconductor package structures by forming a stable inter-layer film that suppresses copper diffusion.
Implementation Method 1
acting as a copper diffusion barrier
Implementation Method 2
forms a three-dimensional network structure between conductive vias and dielectric layers, enhancing adhesive strength
Data Source
AI summary
A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.