Package Structure with Integrated Passive Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more creative packaging techniques for semiconductor dies, particularly in Package-on-Package (PoP) technology, where the integration of passive devices within the package structure affects the height and reliability of the package, leading to issues with board-level joint yield and process window.
Innovation Solution
The solution involves forming a package structure with integrated passive devices (IPDs) bonded to redistribution layers (RDLs) without under bump metallization (UBM) under the IPD joint area, using laser drilling or photolithography to expose conductive layers, and employing full-fill, partial-fill, or no-fill underfill methods to improve reliability and reduce the IPD component height, thereby enlarging the process window.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If integrated passive devices (IPDs) are bonded to redistribution layers with under bump metallization (UBM), then bonding strength is improved, but total height of the IPD component increases
Solution Approach 1:
The patent removes the under bump metallization (UBM) layer from beneath the IPD bonding joint area, extracting only the necessary bonding functionality to the RDL itself. This extraction reduces the total height of the IPD component while maintaining bonding strength through direct bonding to the conductive RDL structure.
Solution Approach 2:
The patent transitions from a vertical stacking approach with multiple layers (substrate, UBM, IPD) to a more integrated configuration where the RDL serves multiple functions. By using the RDL as both the conductive interconnect and the bonding substrate, the design reduces vertical dimensionality while maintaining horizontal functionality.
2Length of stationary object
If integrated passive devices (IPDs) are bonded to redistribution layers without under bump metallization (UBM), then total height of the IPD component is reduced, but bonding reliability may deteriorate
Solution Approach 1:
The redistribution layer (RDL) is designed to serve multiple functions simultaneously: it provides electrical interconnection, acts as the bonding substrate for IPDs, and maintains structural integrity. This multi-functionality eliminates the need for separate UBM layers while preserving bonding reliability through the RDL's inherent conductive and mechanical properties.
Solution Approach 2:
The patent modifies the bonding interface parameters by changing from a multi-layer UBM structure to a direct RDL bonding interface. This parameter change optimizes the bonding characteristics for the specific application, achieving reliable bonds with reduced height by adjusting the bonding surface properties and composition of the RDL.
3Ease of manufacture
If conventional packaging techniques are used, then manufacturing process is simple, but integration density and component footprint are limited
Solution Approach 1:
The patent merges the passive devices (IPDs) directly into the package structure with the RDLs, eliminating the need for separate external passive components. This integration combines multiple functions into a single compact structure, reducing the overall component footprint while maintaining manufacturability through established bonding and deposition processes.
Solution Approach 2:
The IPDs are nested within the package structure, positioned in proximity to or integrated with the RDL layers. This nesting approach allows passive devices to be housed within the same vertical and horizontal space as the active circuitry, maximizing integration density without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the total height of the IPD component, enhances system performance, and increases the process window, improving the reliability and yield of the package structure by allowing for higher integration density and smaller footprints on printed circuit boards.
Implementation Method 1
using laser drilling or photolithography to expose conductive layers
Implementation Method 2
using laser drilling or photolithography to expose conductive layers
Data Source
AI summary
An embodiment is a structure including a first die, a molding compound at least laterally encapsulating the first die, a first redistribution structure including metallization patterns extending over the first die and the molding compound, a first conductive connector comprising a solder ball and an under bump metallization coupled to the first redistribution structure, and an integrated passive device bonded to a first metallization pattern in the first redistribution structure with a micro bump bonding joint, the integrated passive device being adjacent the first conductive connector.