Package Structure Integrating Passive Devices on Redistribution Layer
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving compact and reliable integration of passive components within 3D packaging structures, leading to increased footprint and potential electrical performance issues.
Innovation Solution
The method involves forming a redistribution layer with connection structures on a wafer, integrating passive devices (IPDs) on this layer, and encapsulating solder balls with a molding compound, which allows for compact package structures with improved electrical reliability by reducing loop inductance and protecting components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are integrated on the redistribution layer in 3D packaging, then electrical performance is improved by reducing loop inductance, but device complexity increases
Solution Approach 1:
The patent combines passive components (IPDs) with the redistribution layer into a single integrated structure. The IPDs are formed directly on the redistribution layer, merging two previously separate elements into one unified component that achieves both electrical performance improvement and simplified device architecture.
Solution Approach 2:
The patent transitions from planar packaging to 3D packaging by stacking the IPDs vertically on the redistribution layer. This dimensional change allows passive components to be integrated in the vertical dimension rather than consuming additional horizontal space, thereby improving electrical performance without significantly increasing device footprint.
2Reliability
If solder balls are encapsulated with molding compound, then connection reliability is improved by protecting components, but manufacturing precision requirements increase
Solution Approach 1:
The molding compound is applied as a protective encapsulation layer around the solder balls and IPDs before final assembly completion. This pre-protective measure shields the sensitive electrical connections from environmental damage and mechanical stress during subsequent handling and assembly processes.
Solution Approach 2:
The patent uses molding compound as a composite protective material that combines mechanical strength, electrical insulation, and environmental sealing properties. This composite material provides comprehensive protection for the solder balls and IPDs while maintaining manufacturing feasibility through standard encapsulation processes.
Data Source
AI summary
A package structure is provided comprising a die, a redistribution layer, at least one integrated passive device (IPD), a plurality of solder balls and a molding compound. The die comprises a substrate and a plurality of conductive pads. The redistribution layer is disposed on the die, wherein the redistribution layer comprises first connection structures and second connection structures. The IPD is disposed on the redistribution layer, wherein the IPD is connected to the first connection structures of the redistribution layer. The plurality of solder balls is disposed on the redistribution layer, wherein the solder balls are disposed and connected to the second connection structures of the redistribution layer. The molding compound is disposed on the redistribution layer, and partially encapsulating the IPD and the plurality of solder balls, wherein top portions of the solder balls and a top surface of the IPD are exposed from the molding compound.