Semiconductor Package Isolation Structure for Adhesive Bleeding
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Solution Overview
Problem
In semiconductor device manufacturing, existing wafer-level packaging technologies face challenges in preventing adhesive bleeding and subsequent risks of tilt, cold joints, or voids during the bonding of semiconductor dies, which affect the reliability and yield of the packaging process.
Innovation Solution
The use of isolation structures, such as trenches or dam structures, on the supporting base to prevent adhesive bleeding between semiconductor dies, ensuring proper bonding and encapsulation with an insulating encapsulant to enhance the reliability of the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is applied to bond semiconductor dies to conductive pillars, then bonding strength is improved, but adhesive bleeding occurs that causes tilt, cold joints, or voids
Solution Approach 1:
The supporting base is segmented into isolated bonding regions by forming isolation trenches between adjacent conductive pillars. This segmentation prevents adhesive material applied at one bonding region from bleeding into adjacent regions, thereby eliminating the root cause of tilt, cold joints, and voids while maintaining strong bonding through adequate adhesive coverage at each isolated region.
Solution Approach 2:
Isolation trenches act as intermediary barriers between adjacent bonding regions. These trenches physically intercept and contain the adhesive material within its intended bonding region, preventing harmful lateral flow into neighboring areas. The trenches serve as a mediating structure that enables strong bonding without the negative effects of adhesive bleeding.
2Manufacturing precision
If adhesive material is applied generously to ensure complete coverage, then bonding coverage is improved, but adhesive bleeding increases causing defects
Solution Approach 1:
By dividing the supporting base into isolated bonding regions through trenches, the system allows generous adhesive application within each region without causing bleeding into adjacent regions. The segmentation creates independent containment zones where complete coverage can be achieved safely.
Solution Approach 2:
Isolation trenches are formed in advance before adhesive application, pre-establishing physical barriers that will contain the adhesive. This preliminary action of creating containment structures enables subsequent generous adhesive application without risk of bleeding, as the boundaries are already in place.
Data Source
AI summary
A package structure includes a supporting base, conductive pillars, a first semiconductor die, a second semiconductor die, a first adhesive material, a second adhesive material and an isolation structure. The conductive pillars are disposed in the supporting base, and protruding out from a top surface of the supporting base. The second semiconductor die is adjacent to the first semiconductor die, wherein the first and second semiconductor dies are disposed on the supporting base and electrically connected to the conductive pillars. The first adhesive material is disposed in between the first semiconductor die and the top surface of the supporting base, and partially covering the conductive pillars. The second adhesive material is disposed in between the second semiconductor die and the top surface of the supporting base, and partially covering the conductive pillars. The isolation structure prevents a bleeding of the first and second adhesive material to an adjacent semiconductor die.