Semiconductor Package Isolation Testing with Distributed Electric Field
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Solution Overview
Problem
Semiconductor device packages face issues with dielectric materials failing under high electric fields during high voltage tests, leading to defects, arcing, and incorrect test results due to electric field arcs.
Innovation Solution
A method involving a test handler with conductive slugs and plungers is used to manage electric fields by applying half the high voltage to conductive plates and grounding others, distributing the electric field to prevent concentration and arcing, ensuring effective isolation testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high voltage is applied during isolation testing, then the ability to test isolation effectiveness is improved, but electric field concentration causes dielectric material failure and arcing
Solution Approach 1:
A test handler with distributed conductive elements is introduced as an intermediary between the high voltage source and the device under test. The conductive slugs and plungers with conductive plates distribute the electric field throughout the test handler structure, preventing concentration at any single point while still enabling effective isolation testing
Solution Approach 2:
The test handler is segmented into multiple conductive elements (conductive slugs contacting leads, plungers with conductive plates contacting the mold compound) rather than using a single concentrated contact point. This segmentation distributes the high voltage application across multiple points, reducing electric field concentration and preventing dielectric breakdown
2Device complexity
If conventional testing methods are used, then testing simplicity is maintained, but incorrect test results occur due to arc current
Solution Approach 1:
The test handler acts as an intermediary that conditions the electric field before it reaches the device under test. By distributing the field through its conductive structure, it prevents arc formation that would otherwise corrupt the measurement, thereby improving test accuracy without requiring complex external field control systems
3Reliability
If high voltage is applied directly to leads, then isolation testing capability is achieved, but damage to semiconductor device package occurs
Solution Approach 1:
The test handler is designed with distributed conductive elements that preemptively condition and distribute the electric field before it can concentrate and cause damage. The conductive slugs and plungers create a controlled field distribution pattern that cushions the device package from damaging field concentrations while still enabling isolation verification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents electric field concentration and arcing, ensuring accurate high voltage isolation testing and protecting the semiconductor device package from damage.
Implementation Method 1
A test handler with conductive slugs and plungers is used to manage electric fields by applying half the high voltage to conductive plates and grounding others, distributing the electric field to prevent concentration and arcing
Implementation Method 2
contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip
Data Source
Figure 1~2C
Figure 2A
Figure 2B
AI summary
A method includes placing a semiconductor device package in a test handler, the semiconductor device package having leads of a first portion of a package substrate extending from a mold compound and leads of a second portion isolated from the first portion extending from the mold compound; contacting the first portion with a first and a second conductive slug (713); contacting the second portion with a third and a fourth conductive slug (715); contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip (717); contacting an opposite second surface of the mold compound with a second plunger having a conductive plate and an insulating tip (719); and placing a high voltage on the first conductive slug (721) while placing approximately half the high voltage on the conductive plate of the first plunger (721), and placing a ground voltage on the third conductive slug (721).