Semiconductor Package Isolation Structure With Releasable Thermal Protection
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Solution Overview
Problem
Existing semiconductor packages face challenges in thermal dissipation due to poor thermal conductivity of typical molding materials used, which can lead to heat-related performance issues without compromising electrical insulation.
Innovation Solution
Incorporating an advanced isolation structure with higher thermal conductivity than the encapsulant portion, thermally coupled to the semiconductor die, and applying a releasable layer to protect the isolation structure from damage during handling and assembly, while allowing easy removal before mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If typical molding materials are used to form the package encapsulant body, then electrical insulation properties are excellent, but thermal dissipation capability is poor
Solution Approach 1:
The package body is segmented into two distinct portions: an encapsulant portion made of electrically insulating molding material, and an isolation structure made of material with higher thermal conductivity. This segmentation allows each portion to fulfill its specific function - the encapsulant provides electrical insulation while the isolation structure provides thermal dissipation pathways.
Solution Approach 2:
Different regions of the package body are assigned different material properties. The encapsulant portion uses material optimized for electrical insulation, while the isolation structure uses material optimized for thermal conductivity. This local differentiation of material quality enables simultaneous achievement of electrical insulation and thermal dissipation in different locations.
2Temperature
If an isolation structure with higher thermal conductivity is introduced to improve heat dissipation, then thermal dissipation capability is enhanced, but the isolation structure becomes susceptible to damage during handling
Solution Approach 1:
A releasable protective layer is applied to the isolation structure before the package undergoes handling, transport, or assembly operations. This preliminary protective action prevents damage to the thermally conductive isolation structure during critical handling phases, while the protective layer can be easily removed when no longer needed.
Solution Approach 2:
The releasable protective layer serves as a cushioning protection for the isolation structure before it is exposed to potential damage during handling and assembly. This beforehand protection measures prevents mechanical damage to the more vulnerable isolation structure material.
3Reliability
If a protective layer is applied to protect the isolation structure from damage, then reliability is improved, but the package complexity increases
Solution Approach 1:
The protective layer is designed as a temporary, easily removable component that serves its protection function only during critical handling phases. After the isolation structure is no longer vulnerable, the protective layer is removed. This disposable approach provides necessary protection without permanently increasing package complexity.
Solution Approach 2:
The releasable protective layer is discarded (removed) after it has fulfilled its protective function during handling and assembly. This temporary use and subsequent removal of the protective layer avoids permanent addition of complexity to the final package structure while maintaining reliability during critical phases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation efficiency and protects the isolation structure from damage, ensuring reliable performance and extended lifespan of semiconductor packages.
Implementation Method 1
the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die
Implementation Method 2
the releasable layer is an adhesive tape that is adhered to and releasable from the first surface of the isolation structure
Data Source
AI summary
A semiconductor device includes a semiconductor package, including a package body that includes an encapsulant portion and an isolation structure, a semiconductor die embedded within the package body, and a plurality of leads that protrude out from the encapsulant body, wherein the encapsulant portion and the isolation structure are each electrically insulating structures, wherein the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die, and a releasable layer affixed to the semiconductor package, wherein a first outer face of the package body includes a first surface of the isolation structure, wherein the releasable layer at least partially covers the first surface of the isolation structure, and wherein the releasable layer is releasable from the semiconductor package.