Package Labeler Simulation Using Computed Meshes
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Solution Overview
Problem
The challenge lies in determining if a label can be successfully applied to a package without wrinkles or visual defects, especially as package surfaces become more complex, and in efficiently configuring label application equipment to ensure successful label application, reducing time and costs associated with mold fabrication and label configuration.
Innovation Solution
A method involving the creation of computed meshes for packages and labelers, simulating their interaction with operational parameters, determining deformation and location, and configuring the labeler based on the simulation results to optimize label application success.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical package molds and actual labels are used for evaluation, then label application success can be determined, but costs and time increase significantly
Solution Approach 1:
The patent creates a digital copy (virtual model) of the physical package and label application process. A computed mesh representation of the package geometry is developed, and the label application process is simulated computationally. This virtual copy allows evaluation of label application success without requiring physical package molds or actual labeling operations, thereby reducing both time and cost while maintaining reliability of the evaluation.
Solution Approach 2:
The patent performs the label application evaluation in advance through computational simulation before committing to physical production. By using the virtual model to predict label application outcomes, potential issues are identified and resolved prior to manufacturing, eliminating the need for costly and time-consuming physical trial runs with actual packages and labels.
2Reliability
If physical package molds are fabricated for evaluation, then accurate label application assessment is possible, but costs increase
Solution Approach 1:
The patent replaces expensive physical package molds with a computational mesh model that accurately represents the package geometry. This digital copy captures all necessary surface features and dimensions for evaluating label application, eliminating the need to fabricate physical molds while maintaining assessment accuracy. The virtual model can be modified and re-evaluated without additional manufacturing costs.
Solution Approach 2:
The patent uses inexpensive computational resources (software and processing power) instead of expensive physical molds. The virtual evaluation environment can be created and modified at minimal cost compared to fabricating physical package molds, making the evaluation process economically viable while maintaining reliability.
3Measurement precision
If label application is evaluated after production, then actual performance data is obtained, but time and costs are wasted
Solution Approach 1:
The patent performs label application evaluation before production through computational simulation. The virtual model predicts label application performance and identifies potential defects prior to manufacturing, allowing configuration optimization in advance. This preliminary evaluation provides performance data that guides production setup, eliminating the need for time-consuming post-production testing and iteration.
Solution Approach 2:
The patent implements a feedback loop where the computational simulation results are used to refine the label and package configuration. The virtual evaluation provides immediate feedback on potential label application issues, allowing designers to adjust parameters and re-simulate before committing to production, thereby optimizing performance without additional physical trial runs.
Data Source
AI summary
A method for configuring a package labeler, and or labeling process including: providing a package defined as a computed mesh; providing a computed mesh description of a package labeler; providing operational parameters of a labeling operation for the package; simulating the interaction of the package and the package labeler according to the operational parameters of the labeling operation, the computed mesh of the package labeler and the computed mesh of the package; determining the location and/or deformation of the package mesh during at least a portion of the simulated interaction; and confirming, rejecting, or configuring the package labeler according to the determined location(s).