Electronic Component Package Lead Terminal Design
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Solution Overview
Problem
Conventional electronic-component-housing packages experience resistance loss due to long bonding wires connecting lead terminals and electrodes, and are prone to irregular deformation of lead terminals.
Innovation Solution
The package design includes a container with a rectangular mount and sidewall, where lead terminals extend from inside to outside, with tip parts attached along the mount, reducing the length of connection lines like bonding wires and improving their operability, using materials such as ceramic and metal with high heat conductivity and insulation, and employing brazing alloys for reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead terminals extend through the package from outside to inside, then electrical connection is achieved, but bonding wires become long causing resistance loss
Solution Approach 1:
The lead terminal is configured to extend along the top surface of the ceramic substrate in addition to penetrating through the substrate thickness direction. This dimensional change allows the bonding wire to connect to the lead terminal at a position closer to the semiconductor element, reducing the effective length of the bonding wire and minimizing resistance loss while maintaining electrical connection reliability.
2Reliability
If lead terminals are made to extend through the package, then connection is established, but irregular deformation of lead terminal occurs
Solution Approach 1:
The lead terminal is designed with different structural characteristics at different locations: the portion penetrating the ceramic substrate provides mechanical support and electrical connection, while the portion extending along the top surface provides a stable connection point for the bonding wire. This local differentiation of function reduces stress concentration and prevents irregular deformation while maintaining connection stability.
3Loss of energy
If bonding wires are shortened to reduce resistance loss, then energy loss decreases, but connection operability becomes difficult
Solution Approach 1:
By extending the lead terminal along the top surface of the ceramic substrate, the invention creates an accessible connection point that is both close to the semiconductor element (reducing bonding wire length) and easily accessible for bonding operations. This dimensional configuration simultaneously achieves reduced resistance loss and maintained connection operability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces resistance loss and enhances the operability of connection lines, allowing for easier connection and improved reliability by shortening bonding wires and ensuring uniform resistance, while also preventing irregular deformation of lead terminals.
Implementation Method 1
employing brazing alloys for reliable bonding
Data Source
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AI summary
An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.