Package-Level Thermal Regulator for Electronic Devices
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Solution Overview
Problem
Electronic devices face performance issues and structural failures due to temperature variations, as they operate poorly at extreme temperatures, with some components requiring lower cryogenic temperatures while others need higher operating temperatures, leading to thermal gradient challenges.
Innovation Solution
Incorporating temperature-control components such as heating elements, Peltier devices, thermal contacts, and thermal-isolation components within the device's encapsulation to maintain optimal operating temperatures across different environments, using thermal sensors and control circuits to regulate temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electronic devices operate at higher temperatures, then operational speed and performance improve, but data errors and structural failures increase
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the operating temperature of different device components. The system changes the temperature parameter from a fixed state to a variable state, allowing different regions of the device to operate at optimized temperatures based on their specific requirements, thereby simultaneously improving speed and reliability
Solution Approach 2:
The patent implements local quality by creating temperature zones within the device where different components operate at different temperatures. Heat-generating features are maintained at higher temperatures for optimal performance, while other portions are kept at lower temperatures to prevent errors and failures, giving each part the temperature quality it needs
2Reliability
If electronic devices operate at lower temperatures, then data errors reduce and structural stability improves, but operational speed and performance decrease
Solution Approach 1:
The patent applies local quality by creating spatially differentiated temperature zones within the device. Different components are maintained at different temperatures according to their specific requirements, allowing structural stability in temperature-sensitive regions while maintaining operational speed in performance-critical regions
Solution Approach 2:
The patent segments the device into multiple thermal zones that can be independently controlled. This segmentation allows the system to optimize temperature for different functional requirements simultaneously, preventing the trade-off between reliability and speed that would exist in a uniform temperature system
3Productivity
If heat-generating features are maintained at high temperatures for optimal performance, then operational efficiency improves, but thermal gradients cause structural failures
Solution Approach 1:
The patent applies local quality by allowing different regions of the device to have different temperature characteristics. Heat-generating features are permitted to operate at high temperatures for optimal efficiency, while other portions are maintained at appropriate temperatures to prevent thermal gradient-induced structural failures
Solution Approach 2:
The patent introduces thermal management structures as intermediaries between heat-generating features and the rest of the device. These intermediary elements facilitate controlled heat transfer and temperature distribution, enabling high-temperature operation of specific components without creating damaging thermal gradients throughout the entire device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved performance and reliability of electronic devices by maintaining target operating temperatures, reducing noise and structural failures, and enhancing operational efficiency across varying environmental conditions.
Implementation Method 1
temperature-control components such as heating elements
Implementation Method 2
temperature-control components such as heating elements, Peltier devices
Implementation Method 3
thermal-isolation components within the device's encapsulation
Data Source
AI summary
A semiconductor device includes a substrate; a die attached to the substrate; an encapsulation covering the substrate and the die, wherein the die is embedded within the encapsulation; and a heating element embedded within the encapsulation, wherein the heating element is configured to provide thermal energy to the die.