Semiconductor Package Lid Trenches to Contain Adhesive Bleeding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In semiconductor device packaging, the bleeding and diffusion of conductive and non-conductive adhesive materials can lead to open circuits, short circuits, and poor adhesion, causing reliability concerns due to the lack of effective containment and separation between these materials.

Innovation Solution

A semiconductor device package design that incorporates a carrier, a lid with a conductive and non-conductive adhesive layer, and a trench structure to constrain the adhesive materials, preventing bleeding and diffusion and ensuring precise adhesion and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive materials are applied between the lid and carrier to ensure adhesion, then bonding strength is improved, but bleeding and diffusion of adhesive materials causes open circuits and short circuits

Engineering Contradiction:

Improveadhesion strengthVSAvoidelectrical connection reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The lid is divided into multiple portions (first portion, second portion, third portion) with trenches separating them. This segmentation allows different adhesive materials to be applied to different portions without bleeding into each other, ensuring both adhesion strength and electrical connection reliability by preventing short circuits between conductive adhesives.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different types of adhesive materials (conductive and non-conductive) are applied to different local portions of the lid based on specific electrical connection requirements. The first conductive adhesive is applied to the first portion, while the second conductive adhesive is applied to the second portion, allowing each area to have the appropriate electrical properties for its function.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If adhesive materials are applied without containment structures, then ease of manufacture is improved, but bleeding and diffusion reduces adhesion quality and creates electrical defects

Engineering Contradiction:

Improveadhesive application simplicityVSAvoidadhesive placement precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Trenches are pre-formed in the lid structure before adhesive application. These preliminary containment structures guide the adhesive material during application, preventing bleeding and diffusion while allowing for relatively simple adhesive dispensing processes. The pre-existing trenches provide natural boundaries that improve manufacturing precision without requiring complex adhesive application equipment or techniques.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11776862B2Lid structure and semiconductor device package including the same

Publication Date: 2023.10.03 ADVANCED SEMICON ENG INC

AI summary

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.