Electronic Package Lid and Dam Structure for Multi-TIM Heat Dissipation
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Solution Overview
Problem
Conventional electronic packages face challenges with excess cost, decreased reliability, and low performance due to inadequate heat dissipation capabilities, particularly as power density increases and node sizes decrease, leading to inefficient thermal management.
Innovation Solution
The use of a dam structure with different thermal conductivity interface materials, where a higher thermal conductivity material is separated from a lower thermal conductivity material using a dam structure with a vent to control overflow, allowing for improved heat dissipation and integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single interface material is used across all electronic components, then manufacturing simplicity is maintained, but thermal performance is insufficient for components with different heat dissipation requirements
Solution Approach 1:
The patent applies local quality by selecting different interface materials with appropriate thermal conductivities for different electronic components based on their specific heat dissipation requirements. High-power components receive high-thermal-conductivity materials while low-power components receive lower-thermal-conductivity materials, optimizing thermal performance locally rather than using a uniform material across all components.
Solution Approach 2:
The patent segments the interface material application by dividing the package into regions with different thermal requirements. Dam structures are used to segment and separate the application areas of different interface materials, preventing intermixing while allowing each component to receive the appropriate material type for its thermal needs.
2Manufacturing precision
If dam structures are used to separate different interface materials, then material intermixing is prevented, but manufacturing complexity increases
Solution Approach 1:
The dam structures are formed preliminarily on the substrate before applying the interface materials. This preliminary action creates pre-defined boundaries that guide the precise application of different interface materials to their respective components, ensuring proper separation and preventing intermixing during the dispensing process.
Solution Approach 2:
The dam structures serve as intermediary elements between the interface materials and the electronic components. These dams act as physical barriers that mediate the separation of different materials, allowing each material to be applied independently to its target component without contaminating adjacent areas.
3Temperature
If higher thermal conductivity interface materials are used for all components, then heat dissipation is improved, but cost increases
Solution Approach 1:
The patent optimizes cost by applying high-thermal-conductivity interface materials only to high-power electronic components that genuinely require superior heat dissipation. Low-power components receive lower-cost, lower-thermal-conductivity materials, avoiding unnecessary expense while maintaining adequate thermal performance for each component's specific requirements.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the interface materials based on the power dissipation characteristics of individual components. By matching material parameters to component requirements rather than using a uniform high-performance material everywhere, the solution achieves optimal thermal management at reduced manufacturing cost.
4Area of moving object
If node sizes are decreased to improve integration density, then device miniaturization is achieved, but heat dissipation challenges increase
Solution Approach 1:
As node sizes decrease and power density increases, the patent applies local quality by carefully selecting interface materials with thermal conductivities matched to the specific power density of each miniaturized component. This ensures that even small components with high power density receive appropriate thermal management without requiring uniform high-cost materials across the entire package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance, reliability, and manufacturing efficiency by allowing for the use of materials tailored to specific thermal requirements, reducing contact resistance, and preventing intermixing of interface materials, thus improving overall heat dissipation and package reliability.
Implementation Method 1
A first interface material with a higher thermal conductivity than the second interface material is over the first electronic component top side and contained within the dam structure
Implementation Method 2
A dam structure is connected to the first electronic device top side and the lid ceiling within the lid periphery and having a vent
Data Source
AI summary
In one example, an electronic device includes a substrate having a substrate top side, a substrate bottom side opposite to the substrate top side. A first electronic component is connected to the substrate top side and having a first electronic component top side distal to the substrate top side. A second electronic is connected to the substrate top side, laterally spaced apart from the first electronic component, and having a second electronic component top side distal to the substrate top side. A lid is connected to the substrate top side, covering the first electronic component and the second electronic component. The lid includes a lid ceiling; and a lid wall extending from the lid ceiling and defining a lid periphery. A dam structure is connected to the first electronic device top side and the lid ceiling within the lid periphery and having a vent. A first interface material is over the first electronic component top side and contained within the dam structure. A second interface material is over the second electronic component top side and connected to the lid ceiling, where the dam structure separates the first interface material from the second interface material. The first interface material has a higher thermal conductivity than the second interface material. Other examples and related methods are also disclosed herein.