Semiconductor Package Lid Hook Structure With Deformation Holes
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Solution Overview
Problem
Existing semiconductor devices face challenges in reliably fitting a lid into a case while minimizing the device's height, as traditional extending portions require a significant length to counteract reaction forces, leading to increased height and potential breakage.
Innovation Solution
The semiconductor device incorporates a lid with multiple extending portions and corresponding deformation holes, which are hooked onto hook portions in the case, allowing for reliable fitting and reducing the device's height by alleviating reaction forces through deformation hole design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the extending portion is made long to alleviate reaction force deformation, then the fitting reliability is improved, but the device height increases
Solution Approach 1:
The extending portion is divided into multiple segments by introducing deformation holes, allowing the structure to deform in a controlled step-by-step manner during fitting, which distributes the reaction force and enables shorter overall length while maintaining reliability
Solution Approach 2:
The deformation holes change the mechanical parameters of the extending portion by creating controlled weak points that alter the deformation characteristics, enabling the portion to flex more efficiently and reduce the required length for adequate reaction force absorption
2Reliability
If the extending portion is made long to alleviate reaction force deformation, then the fitting reliability is improved, but the risk of breakage increases
Solution Approach 1:
The deformation holes segment the extending portion into multiple smaller sections, distributing the stress and preventing concentration of forces that would lead to breakage, while still providing sufficient compliance for reliable fitting
Solution Approach 2:
The deformation holes act as pre-designed stress relief points that cushion the reaction force before it can propagate through the entire extending portion, preventing breakage by absorbing and distributing the mechanical stress in advance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures the lid is securely fitted into the case, reduces the device's height, and prevents extending portion breakage, while also potentially reducing costs by omitting adhesive materials.
Implementation Method 1
a plurality of deformation holes, and the case includes a plurality of hook portions on which the protrusions of the extending portions are respectively hooked
Data Source
AI summary
A semiconductor device includes a circuit substrate having a semiconductor element thereon, a case surrounding a periphery of the circuit substrate so as to house the circuit substrate therein, and a lid disposed above the circuit substrate so as to close the case at an upper side thereof. The lid includes a plurality of extending portions including a first extending portion and a second extending portion, and a plurality of deformation holes respectively provided for one of the plurality of extending portions. The plurality of extending portions each extend from a lower surface of the lid facing the circuit substrate toward the circuit substrate and have a protrusion at an end thereof. The protrusion of the first extending portion protrudes in a first direction and the protrusion of the second extending portion protrudes in a second direction opposite to the first direction. The case includes a plurality of hooked portions that respectively hook on respective ones of the protrusions of the plurality of extending portions.