Semiconductor Package Lid Structure for Precise Device Gap Control
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Solution Overview
Problem
Conventional semiconductor package manufacturing methods fail to precisely control the gap size between the device and the molding material, leading to inaccuracies in parameters such as air flow resistance, heat dissipation, and mechanical durability, especially for optical devices.
Innovation Solution
Incorporating metal components like studs or bumps between the device and the lid in the package structure, which allows for precise control of the gap width by referencing the standard deviation of the metal component's height, reducing the impact of molding material tolerances and enabling more accurate gap size determination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional molding material is used to package semiconductor devices, then the packaging process is simple and fast, but the gap size between device and molding material cannot be precisely controlled
Solution Approach 1:
A lid is introduced as an intermediary component between the molding material and the device. The lid includes a cavity that receives the device and a bottom surface that forms a controlled gap with the device top surface. This mediator enables precise gap size control through the cavity design while keeping the molding material's role simple.
Solution Approach 2:
The package structure is segmented into distinct functional zones: the molding material provides overall protection, the lid cavity provides precise gap control, and the bottom surface of the lid provides the controlled interface. This segmentation allows each component to optimize its function without compromising others.
2Manufacturing precision
If conventional molding methods are used, then manufacturing is efficient, but statistical tolerances accumulate leading to incorrect parameters
Solution Approach 1:
The lid cavity is pre-formed with precise dimensions before device assembly. The gap size is determined in advance by the cavity design rather than by post-assembly adjustments or relying on tolerance stacks. This preliminary action ensures parameter precision is built into the structure itself.
Solution Approach 2:
The gap size parameter is controlled by changing the cavity design parameters of the lid rather than relying on molding material shrinkage or compression parameters. This shifts the control mechanism to a more predictable and precise geometric parameter.
3Reliability
If gap size is not precisely controlled, then manufacturing is simpler, but mechanical durability and performance of optical devices suffer
Solution Approach 1:
The lid acts as a mediator that provides the precisely controlled gap necessary for optical device performance while protecting the device from direct contact with the molding material. This intermediary structure ensures mechanical durability through proper spacing and stress distribution.
Data Source
AI summary
The present disclosure provides a package structure. The package structure includes a base, a device disposed on the base, a lid disposed over the base and the device and spaced apart from the device, and a first metal component disposed between the device and the lid, wherein the first metal component contacts the device and the lid. The present disclosure also provides a method for forming a package structure.