Semiconductor Package Lid Opening for Precise Internal Gap Measurement
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Solution Overview
Problem
Conventional methods fail to precisely determine parameters, particularly gap sizes, within semiconductor device packages due to accumulated deviations and tolerances, leading to incorrect or insufficiently precise measurements.
Innovation Solution
A package structure design with a tapered opening in the lid allows for optical and electrical measurements to derive gap widths accurately, using focal plane differences for optical methods and capacitance measurements for electrical methods, eliminating the need to consider tolerances in component dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional measuring methods are used to determine parameters inside molded semiconductor packages, then the measurement process is simple, but the measurement precision is insufficient due to accumulated deviations and tolerances
Solution Approach 1:
The patent applies preliminary action by forming a tapered opening in the lid before final packaging, which enables subsequent optical or electrical measurement methods to access internal gap dimensions. This pre-prepared access path allows precise measurement without compromising the sealed package structure, resolving the contradiction between measurement precision and device complexity.
2Manufacturing precision
If component dimensions are specified with tight tolerances to improve measurement accuracy, then the manufacturing precision increases, but the ease of manufacture decreases
Solution Approach 1:
The patent replaces mechanical measurement methods with optical or electrical measurement techniques. Instead of physically disassembling the package to measure gap dimensions mechanically, the invention uses optical fields or electrical fields to determine internal dimensions, thereby maintaining manufacturing simplicity while achieving high measurement precision.
3Reliability
If the package structure is made fully sealed to protect the device, then the reliability improves, but the ease of detecting and measuring internal parameters worsens
Solution Approach 1:
The patent introduces an intermediary measurement structure (tapered opening with known geometry) that mediates between the sealed package environment and external measurement equipment. This intermediary allows optical or electrical fields to penetrate through the lid and interact with internal components, enabling non-contact measurement of gap dimensions while maintaining package sealing integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of gap widths within semiconductor packages, enhancing device performance and reliability by accounting for variations in molding member and device dimensions.
Implementation Method 1
optical measurements to derive gap widths accurately, using focal plane differences
Implementation Method 2
irradiating a top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device; irradiating the lid at the lower end of the opening to obtain a second focal plane
Implementation Method 3
electrical measurements to derive gap widths accurately, using focal plane differences for optical methods and capacitance measurements for electrical methods
Data Source
AI summary
The present disclosure provides a measurement method including providing a base, a device disposed on the base, and a lid disposed over the base and the device; irradiating a top surface of the device through an opening of the lid to obtain a first focal plane associated with a top surface of the device; irradiating the lid at the lower end of the opening to obtain a second focal plane associated with the lid at the lower end of the opening; and deriving a distance between the top surface of the device and an interior surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane. The present disclosure also provides a package structure for the measurement.