Semiconductor Package Lid Structure for Better Heat Dissipation
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Solution Overview
Problem
Existing package structures and fabrication methods for semiconductor devices, particularly in package on package (POP) configurations, are inadequate in terms of heat dissipation efficiency and overall performance.
Innovation Solution
A package structure is designed with alternating protruding structures and a thermal interface material (TIM) that includes stacked protruding structures thermally connected to both the semiconductor die and a lid structure, enhancing heat dissipation through vertical and horizontal transfer pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional package structures are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The thermal interface material is segmented into multiple layers with alternating high thermal conductivity and low thermal conductivity. This segmentation creates distinct thermal pathways that improve overall heat dissipation efficiency while maintaining manageable structural complexity through systematic layering.
Solution Approach 2:
Different regions of the thermal interface material have different thermal conductivity properties. High thermal conductivity regions are positioned to create efficient heat transfer pathways, while low thermal conductivity regions provide thermal isolation where needed. This local differentiation optimizes heat dissipation without requiring complete restructuring of the entire package.
2Temperature
If simple thermal interface materials are used, then manufacturing ease is maintained, but heat transfer performance deteriorates
Solution Approach 1:
The thermal interface material is divided into alternating layers of high and low thermal conductivity materials. This segmentation enables optimized heat transfer performance through multiple thermal pathways while maintaining manufacturing feasibility through a systematic, repeatable layering process.
Solution Approach 2:
The thermal interface material uses composite construction with alternating layers of materials having different thermal conductivity properties. This composite structure achieves superior heat transfer performance by combining materials with complementary thermal characteristics in a controlled alternating pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation efficiency, leading to enhanced power efficiency and performance of the semiconductor package.
Implementation Method 1
a thermal interface material (TIM) structure between the first die and the lid structure... The heat generated by the first die can be transferred to the external environment by the protruding structures in the TIM
Data Source
AI summary
A package structure and method for forming the same are provided. The package structure includes a first die formed over a substrate, and a lid structure formed over the first die. The package structure also includes a thermal interface material structure between the first die and the lid structure. The thermal interface material structure includes a plurality of first protruding structures connected to the first die, a plurality of second protruding structures connected to the lid structure and a thermal conductivity material between the first protruding structures and the second protruding structures.