Package Lid with Embedded Active Cooling for IC Hot Spots
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Solution Overview
Problem
The challenge of impaired thermal performance in semiconductor integrated circuits (ICs) due to localized heat generation at hot spots, which affects performance and reliability, is not adequately addressed by existing technologies.
Innovation Solution
A customized heat dissipation solution for a package component using a lid that includes an embedded cooling device is configured to dissipate heat from local hot spots by embedding an active cooling device in the lid, which is powered to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC geometry size is decreased to increase functional density, then production efficiency and cost are improved, but thermal performance deteriorates and localized hot spots are generated
Solution Approach 1:
The patent applies local quality by transitioning from uniform heat dissipation to localized heat dissipation targeting specific hot spots. The system uses thermal sensors to detect high-temperature regions and activates cooling elements only at those locations, rather than cooling the entire IC surface uniformly. This localized approach resolves the contradiction by maintaining high functional density while addressing thermal performance issues only where needed.
Solution Approach 2:
The patent implements dynamics by making the heat dissipation system adaptive and controllable. The system dynamically adjusts cooling activation based on real-time temperature monitoring, allowing selective engagement of cooling elements in response to changing thermal conditions. This dynamic control enables the system to maintain optimal thermal performance across different operating conditions while preserving high functional density.
2Quantity of substance
If IC geometry size is decreased, then functional density increases, but heat dissipation capability deteriorates
Solution Approach 1:
The system applies local quality by concentrating cooling resources at identified hot spot locations rather than distributing them uniformly across the IC surface. This targeted approach maximizes heat dissipation efficiency at critical locations while minimizing energy waste in cooler regions, thereby improving overall heat dissipation capability without compromising functional density.
Solution Approach 2:
The system implements self-service through autonomous thermal management. Thermal sensors continuously monitor the IC surface and automatically trigger cooling elements in response to detected hot spots without external intervention. This self-regulating mechanism ensures that heat dissipation capability keeps pace with functional density increases, as the system autonomously adapts to thermal conditions generated by high-density circuits.
3Ease of manufacture
If uniform heat dissipation is applied across the IC surface, then manufacturing is simplified, but localized hot spots are not effectively addressed
Solution Approach 1:
The patent applies segmentation by dividing the IC surface into multiple zones with independently controllable cooling elements. Each zone can be selectively activated based on local thermal conditions, allowing the system to address localized hot spots effectively. This segmented approach maintains manufacturing feasibility through modular design while significantly improving hot spot management capability compared to uniform heat dissipation.
Solution Approach 2:
The system implements local quality by providing differentiated thermal management for different regions of the IC surface. Instead of applying uniform cooling, the system tailors cooling activation to local thermal needs identified by sensors. This regional customization improves reliability by effectively addressing hot spots while maintaining ease of manufacture through standardized sensor and cooler component integration.
4Temperature
If active cooling devices are embedded in the lid, then heat dissipation from hot spots is enhanced, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating the active cooling device directly into the lid structure that covers the IC. This combination eliminates the need for separate cooling assemblies and reduces overall system complexity. The embedded cooling elements become part of the lid itself, allowing enhanced heat dissipation from hot spots while minimizing the increase in device complexity through structural integration.
Solution Approach 2:
The system implements self-service through automated thermal management controlled by integrated sensors and control circuitry. The cooling device activates autonomously in response to detected hot spots without requiring complex external control systems. This self-regulating capability enhances heat dissipation efficiency while limiting the increase in device complexity by using simple sensor-triggered control logic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively directs heat radially away from the hot spots, improving thermal management and ensuring reliable operation of semiconductor packages.
Implementation Method 1
a thermoelectric cooling unit configured to dissipate the heat radially away from the hot spot
Implementation Method 2
a thermal conduction plate thermally coupled to the hot spot
Data Source
AI summary
A package structure according to the present disclosure includes a package substrate, a package component disposed over the package substrate, a lid disposed over the package substrate and the package component, and an active cooling device embedded in the lid.