Semiconductor Package Lid Cooling for Hotspot and Dry-Out Control
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Solution Overview
Problem
Existing thermal management systems for semiconductor packages are inefficient in targeting and managing localized hotspots, particularly during specific operations, leading to reduced cooling capacity and potential dry-out of vapor chambers.
Innovation Solution
Integration of thermoelectric coolers at predetermined hotspots within the semiconductor package lid, combined with a vapor chamber and wick structure, and controlled by temperature or operational feedback to actively manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a vapor chamber is used for thermal management, then heat dissipation is improved, but the vapor chamber may dry-out during specific operations
Solution Approach 1:
The patent divides the thermal management system into multiple zones: a first region with a first thermoelectric cooler, a second region with a second thermoelectric cooler, and a third region without a thermoelectric cooler. This segmentation allows targeted cooling of specific hotspots while preserving vapor chamber functionality in other areas, preventing dry-out.
Solution Approach 2:
The patent applies different thermal management strategies to different regions: thermoelectric coolers are applied locally to predetermined hotspots where high heat generation is expected, while other regions rely on the vapor chamber. This local quality approach optimizes cooling where needed without causing vapor chamber dry-out.
2Temperature
If thermoelectric coolers are added to target hotspots, then localized cooling is improved, but device complexity increases
Solution Approach 1:
The patent implements thermoelectric coolers only in specific regions where hotspots are predetermined to occur, rather than uniformly across the entire package. This localized approach provides targeted cooling while minimizing the addition of complex components.
Solution Approach 2:
The patent employs dynamic control of thermoelectric coolers based on monitored operation of the semiconductor package. The coolers are activated only when and where hotspots are detected, rather than operating continuously, which simplifies control logic and reduces overall system complexity.
3Temperature
If continuous cooling is applied, then temperature control is improved, but energy consumption increases
Solution Approach 1:
The patent controls thermoelectric coolers based on monitored operation of the semiconductor package, activating cooling only during periods when hotspots are detected. This periodic action replaces continuous cooling, reducing energy consumption while maintaining effective temperature control.
Solution Approach 2:
The patent uses monitored operation data as feedback to control the thermoelectric coolers. The system adjusts cooling activation based on actual operational conditions and hotspot detection, optimizing energy consumption by applying cooling only when and where it is needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling capacity by 10% and reduces vapor chamber dry-out, providing efficient, localized, and time-dependent thermal management.
Implementation Method 1
A thermoelectric cooler is disposed on or in the lid positioned at the predetermined hotspot of the one or more semiconductor dies
Implementation Method 2
vapor chamber and wick structure
Implementation Method 3
vapor chamber and wick structure
Data Source
AI summary
A semiconductor package includes one or more semiconductor dies, and a lid disposed on the one or more semiconductor dies. One or more thermoelectric coolers are disposed on or in the lid. Each thermoelectric cooler is positioned at a predetermined hotspot of the one or more semiconductor dies. In one method of operating such a semiconductor package, functions are run on one or more semiconductor dies of the semiconductor package. During the running of these functions, one or more predetermined hotspots of the one or more semiconductor dies are cooled by operating a thermoelectric cooler positioned at each respective predetermined hotspot.