Package Lid Island Structure for Semiconductor Heat and Stress Control
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic systems poses challenges in achieving higher speed and lower transmission loss, requiring innovative packaging and assembling techniques to enhance electrical performance and mechanical stability.
Innovation Solution
A semiconductor device manufacturing method involving a package lid with a distinct island and ribs structure, detached from the footing, which enhances thermal dissipation and mechanical stability by reducing mechanical stress and delamination risks, while maintaining structural rigidity and flexibility for efficient integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in miniaturized electronic systems, then device functionality and electrical performance are improved, but mechanical stress and delamination risks increase
Solution Approach 1:
The package lid is segmented into multiple functional regions: a footing region for mechanical support and bonding, an island region for thermal management, and rib structures connecting them. This segmentation allows each region to optimize its function independently, reducing mechanical stress concentration and preventing delamination while maintaining integration capability
Solution Approach 2:
Different regions of the package lid are designed with locally optimized properties: the footing has enhanced mechanical strength for bonding, the island has high thermal conductivity for heat dissipation, and the ribs provide structural reinforcement. This local quality differentiation resolves the contradiction by allowing high integration in specific areas without compromising overall mechanical stability
2Strength
If package lid structure is made more rigid to maintain structural stability, then mechanical strength is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The package lid is divided into a rigid footing region for structural support and a thermally conductive island region for heat dissipation, connected by rib structures. This segmentation enables the structure to simultaneously achieve high rigidity where needed and efficient thermal management where required
Solution Approach 2:
The package lid employs composite material properties through its multi-region design, combining materials or structures with different thermal and mechanical characteristics in specific locations to achieve both structural rigidity and thermal dissipation without compromise
3Strength
If adhesive is applied extensively to bond package lid to circuit substrate, then bonding strength is improved, but risk of delamination under mechanical stress increases
Solution Approach 1:
The bonding interface is segmented into discrete bonding regions at the footing and rib contact points rather than continuous adhesive application. This segmentation concentrates bonding strength at critical locations while reducing the total adhesive area susceptible to delamination under mechanical stress
Solution Approach 2:
The rib structures serve as preemptive stress distribution elements that cushion and分散 mechanical loads before they can concentrate at the adhesive bonds, thereby protecting the bonding interfaces from delamination while maintaining bonding strength where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal dissipation and mechanical stability, increasing the reliability and yield of semiconductor devices by reducing mechanical stress and enhancing structural stability, thus addressing the challenges of miniaturization and integration.
Implementation Method 1
A first thermal interface material is disposed on a rear surface of the first semiconductor die
Implementation Method 2
A first adhesive is disposed on the circuit substrate... adhering the package lid to the circuit substrate
Data Source
AI summary
Semiconductor device includes a circuit substrate, a first semiconductor die and a package lid. The first semiconductor die is disposed on and electrically connected to the circuit substrate. The package lid extends over the first semiconductor die and is bonded to the circuit substrate. the package lid comprises a roof extending, a footing and an island. The roof extends along a first direction and a second direction perpendicular to the first direction. The footing is disposed at a peripheral edge of the roof and protrudes from the roof towards the circuit substrate along a third direction perpendicular to the first direction and the second direction. The island protrudes from the roof towards the circuit substrate, wherein the island is disconnected from the footing along the second direction, and the island is physically connected to the footing along the first direction.