Semiconductor Package Lid Lip for Secure Adhesive Bonding
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Solution Overview
Problem
Packaged semiconductor devices with lids attached via adhesive layers are prone to slippage, poor adhesion, and detachment due to lateral forces or mechanical shocks, especially when the lid is not properly aligned or bonded to the moulding compound.
Innovation Solution
Incorporating a lip around the moulding compound on the lid, which extends beyond the moulding compound's surface, provides additional bonding area and aids in self-alignment during assembly, enhancing the adhesion between the lid and the moulding compound, and includes through-holes for cavity access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat lid is attached to the moulding compound by means of an adhesive layer, then the packaging process is completed, but the lid is prone to slippage, poor adhesion, or detachment
Solution Approach 1:
The lid transitions from a flat two-dimensional structure to a three-dimensional structure with a peripheral lip that extends downward onto the moulding compound. This dimensional change creates additional bonding surface area and mechanical interlocking, resolving the adhesion reliability issue while maintaining manufacturing simplicity
Solution Approach 2:
The lip is pre-formed as an integral part of the lid structure before the bonding process. This preliminary formation of the bonding feature ensures proper alignment and maximizes adhesive contact area during the attachment process, preventing slippage and improving bond reliability
2Ease of operation
If the lid is attached without a lip structure, then the assembly is simpler, but the lid lacks proper alignment and bonding surface area
Solution Approach 1:
The lip structure enables self-alignment during assembly by providing a geometric feature that naturally positions the lid over the moulding compound. The lip's downward extension creates a self-centering effect that ensures proper alignment without requiring complex external alignment mechanisms, maintaining assembly simplicity while improving positioning precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lip design improves the stability and adhesion of the lid to the semiconductor device, reducing the risk of detachment and misalignment, while allowing for enhanced manufacturability and assembly simplicity.
Implementation Method 1
an adhesive material, between a surface of the moulding compound and the lid and providing a bond therebetween
Data Source
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AI summary
A packaged semiconductor device (200) is disclosed, having a first major surface (210), a second major surface (220), and sidewalls (230) therebetween, the packaged device comprising: a moulding compound (240) around a perimeter of the device and defining at least a part of the sidewalls; a lid (250) defining the first major surface, and defining a cavity (252) within the packaged semiconductor device; wherein the lid extends from a central region, to and beyond an upper surface of the moulding compound, and comprises a lip (260) around at least part of the moulding compound; further comprising an adhesive material (270), between a top surface of the moulding compound and the lid and providing a bond therebetween. Related methods are also disclosed.