Semiconductor Package Lid Lip Structure for Secure Cavity Sealing
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Solution Overview
Problem
Packaged semiconductor devices with cavities face issues of lid slippage and poor adhesion due to the use of adhesive layers, which can lead to detachment and misalignment during assembly and under mechanical stress.
Innovation Solution
Incorporating a lip on the lid that extends beyond the moulding compound, providing additional surface area for bonding and aiding in self-alignment, along with the use of an adhesive material between the moulding compound and the lid, enhances the adhesion and stability of the lid attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat lid is attached to the moulding compound by means of an adhesive layer, then the packaging process can be completed, but the lid is prone to slippage or poor adhesion
Solution Approach 1:
The lid transitions from a flat two-dimensional structure to a three-dimensional structure with protruding lips that extend beyond the moulding compound perimeter. This dimensional change creates additional bonding surfaces and mechanical interlocking features, resolving the adhesion problem while maintaining ease of manufacture through the same adhesive application process.
Solution Approach 2:
The lips are pre-formed on the lid before attachment, creating predetermined bonding zones that extend beyond the moulding compound. This preliminary structuring ensures that when adhesive is applied, it has extended surface area and mechanical features already in place to prevent slippage, eliminating the need for additional alignment or reinforcement steps.
2Device complexity
If a flat lid is used without extending beyond the moulding compound, then the device structure is simple, but the lid lacks proper positioning and bonding surface area
Solution Approach 1:
The lid extends in the vertical dimension beyond the moulding compound perimeter, creating lips that provide both positioning features and bonding surface area. This three-dimensional configuration improves positioning precision without significantly complicating the manufacturing process, as the extension can be formed through standard molding or forming techniques.
Solution Approach 2:
The protruding lips on the lid provide self-alignment and self-positioning features during assembly. The lips naturally guide the lid into correct positioning relative to the moulding compound, and the extended surface area provides inherent bonding zones, allowing the structure to serve its own positioning and bonding needs without additional fixtures or alignment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces the risk of lid displacement and detachment, improving the bonding strength and assembly reliability of packaged semiconductor devices by providing a secure and stable attachment mechanism.
Implementation Method 1
an adhesive material, between a surface of the moulding compound and the lid and providing a bond therebetween
Data Source
AI summary
A packaged semiconductor device (200) is disclosed, having a first major surface (210), a second major surface (220), and sidewalls (230) therebetween, the packaged device comprising: a moulding compound (240) around a perimeter of the device and defining at least a part of the sidewalls; a lid (250) defining the first major surface, and defining a cavity (252) within the packaged semiconductor device; wherein the lid extends from a central region, to and beyond an upper surface of the moulding compound, and comprises a lip (260) around at least part of the moulding compound; further comprising an adhesive material (270), between a top surface of the moulding compound and the lid and providing a bond therebetween. Related methods are also disclosed.