Liquid-Cooled Package Lid With Microchannels for Lower Thermal Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in effectively cooling semiconductor devices due to the limitations of traditional packaging techniques, which hinder the integration of high-density electronic components and increase thermal resistance.
Innovation Solution
A packaged semiconductor device is developed with a liquid-cooled lid featuring micro channels that utilize dielectric-to-dielectric bonding and materials like silicon, glass, or metal, coupled with a cooling cover to supply liquid coolant, enhancing thermal conductivity and cooling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging techniques are used, then manufacturing simplicity is maintained, but cooling capacity is insufficient and thermal resistance increases
Solution Approach 1:
The lid is merged with multiple functions: it serves as a structural cover, a heat dissipation component with integrated microchannels, and a mounting platform for the semiconductor die. This consolidation of functions into a single component improves cooling capacity without proportionally increasing device complexity.
Solution Approach 2:
The patent introduces a liquid cooling system with microchannels formed in the lid, allowing coolant flow through the packaging structure. This hydraulic approach directly addresses the cooling capacity limitation by implementing forced convection heat removal within the packaging itself.
2Temperature
If copper is used for the lid to improve thermal conductivity, then cooling performance increases, but manufacturing cost increases
Solution Approach 1:
The patent changes the material parameter from copper to silicon, which can be manufactured using standard semiconductor fabrication processes. While silicon has lower thermal conductivity than copper, the integrated microchannel design and direct die-to-lid bonding compensate for this, achieving adequate cooling performance at lower cost.
Solution Approach 2:
The patent replaces the mechanical/thermal approach of using high-conductivity copper material with a system approach that uses silicon material combined with microchannel fluid flow and direct bonding to achieve heat dissipation.
3Temperature
If die-to-dielectric bonding is used to couple the lid to the semiconductor die, then thermal resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming the microchannels in the lid before bonding, and by preparing the bonding surfaces with appropriate dielectric layers and roughness characteristics. This preliminary preparation facilitates the subsequent bonding process and helps achieve good thermal contact.
Solution Approach 2:
The patent applies local quality by creating specific surface characteristics at the bonding interface, including dielectric layer deposition and controlled roughness, to optimize both thermal contact and bonding strength at the critical interface region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the cooling capacity of semiconductor devices, reduces thermal resistance, and allows for cost-effective manufacturing by using silicon instead of copper, while maintaining compatibility with conventional semiconductor processes.
Implementation Method 1
a liquid-cooled lid featuring micro channels that utilize dielectric-to-dielectric bonding and materials like silicon, glass, or metal, coupled with a cooling cover to supply liquid coolant, enhancing thermal conductivity and cooling capacity
Data Source
AI summary
Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.