Gas-Permeable Package Lid With Anchored Membrane Bonding

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Solution Overview

Problem

Current hydrophobic gas-permeable membranes in gas sensors have poor bonding due to their hydrophobic properties, leading to durability issues and unreliable performance in environmental monitoring applications.

Innovation Solution

A gas-permeable package lid structure with an integrally formed lid body and embedded hydrophobic gas-permeable membrane, featuring anchors and recesses for secure bonding, which enhances the fixation and reliability of the membrane without additional fixing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hydrophobic gas-permeable membrane is fixed on air holes via adhesion after chip packaging, then the gas sensor can perform environmental sensing, but the bonding is poor due to the hydrophobic property repelling adhesives

Engineering Contradiction:
Improvebonding reliabilityVSAvoidfixation difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming anchors and recesses in the lid body before bonding the hydrophobic gas-permeable membrane. The recesses are pre-formed to receive the membrane, and anchors are pre-positioned to mechanically interlock with the membrane, ensuring proper alignment and strong bonding before the actual bonding process occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies segmentation by dividing the bonding interface into multiple components: the lid body with anchors, the hydrophobic gas-permeable membrane, and recesses formed in the membrane. This segmentation allows each component to be optimized independently and assembled together for strong mechanical interlocking and chemical bonding.

Inventive Principle:
Principle #1Segmentation

2Reliability

If additional fixing processes are used to improve membrane bonding, then bonding reliability improves, but manufacturing complexity and costs increase

Engineering Contradiction:
Improvemembrane bonding reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies merging by combining multiple functions into the lid body structure: the lid body simultaneously provides structural support, forms integrated anchors for mechanical interlocking, and creates recesses for membrane positioning. This integration eliminates the need for separate fixing components and processes, reducing manufacturing complexity while improving bonding reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies self-service by designing the lid body to automatically provide bonding features through its own structure. The anchors and recesses are formed as integral parts of the lid body during molding, eliminating the need for external fixing mechanisms or additional assembly steps. The structure serves its own bonding function without requiring separate fixing components.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved bonding and reliability of the hydrophobic gas-permeable membrane, reducing the risk of detachment and enhancing the durability and environmental tolerance of gas sensors, while also simplifying the manufacturing process and reducing costs.

Implementation Method 1

An encapsulation material in liquid form is cured into a lid body

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Implementation Method 2

hydrophobic gas-permeable membrane

Methodology Applied
Scientific EffectGas permeation: Permeation

Implementation Method 3

the hydrophobic gas-permeable membrane must be hydrophobic

Methodology Applied
Scientific EffectHydrophobic property: Hydrophobe

Data Source

PatentUS20240363456A1Gas-permeable package lid of chip package structure and manufacturing method thereof
Publication Date: 2024.10.31 IND TECH RES INST
  • US20240363456A1 patent drawing
  • US20240363456A1 patent drawing
  • US20240363456A1 patent drawing

AI summary

A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, an air hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed with an encapsulation material and has a body portion and a plurality of anchors. The air hole penetrates the body portion of the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and has a shielding part shielding the air hole and an embedded part embedded in the lid body. The embedded part has an upper surface and a lower surface. The upper surface and the lower surface respectively have a plurality of recesses. The anchors are respectively located in the recesses.