Semiconductor Package Lid Structure for Heat Dissipation and Resin Isolation
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Solution Overview
Problem
Conventional semiconductor devices face issues with mold resin seizing on the chip at high temperatures, inadequate heat dissipation leading to thermal resistance problems, parasitic capacitance, moisture intrusion, and electromagnetic interference, which hinder high-frequency performance and reliability.
Innovation Solution
A semiconductor device design featuring a semiconductor chip on a board with a Cu lid and mold resin where the mold resin's height is lower than the lid's, allowing for efficient heat dissipation through the Cu core and preventing resin contact with the chip, while the Cu lid's tunnel structure and exposed areas enhance thermal conductivity and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the semiconductor chip is driven at high temperature for long time, then the output and power density are increased, but the mold resin becomes seized on the semiconductor chip causing failure
Solution Approach 1:
The patent extracts the mold resin from direct contact with the semiconductor chip by forming a recess in the mold resin that exposes the lid surface. This separation prevents the mold resin from seizing on the chip during high-temperature operation, thereby maintaining reliability while allowing high power output.
Solution Approach 2:
The patent segments the sealing structure into distinct functional zones: the mold resin provides external sealing and mechanical protection, while the lid provides thermal management and electrical isolation. This segmentation allows each component to perform its optimal function without interfering with the other.
2Device complexity
If heat dissipation is relied on ground electrode surface through filled via of multilayer printed board, then the structure is simple, but thermal resistance is high and long-term reliability is difficult to achieve
Solution Approach 1:
The patent adds a vertical heat dissipation dimension by exposing the lid surface above the mold resin level. This creates a new thermal pathway from the chip through the lid to the external environment, complementing the horizontal heat dissipation through the ground electrode. This dimensional addition significantly reduces thermal resistance while maintaining structural simplicity.
3Reliability
If mold resin enters between electrodes of semiconductor chip, then the chip is sealed and protected, but parasitic capacitance is generated deteriorating high frequency characteristics
Solution Approach 1:
The patent extracts the mold resin from the space between the chip electrodes by forming a recess that exposes the lid surface. This prevents the mold resin from entering and contacting the electrodes, eliminating parasitic capacitance generation while the lid maintains the sealing and protective function.
4Reliability
If mold resin is used for sealing, then electrical insulation is ensured and physical impact damage is prevented, but moisture entry is not prevented and moisture resistance deteriorates
Solution Approach 1:
The patent introduces the lid as an intermediary component between the semiconductor chip and the mold resin. The lid provides hermetic sealing that blocks moisture penetration, while the mold resin continues to provide electrical insulation and mechanical protection. This intermediary structure eliminates moisture intrusion while preserving the beneficial protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents resin seizing, reduces thermal resistance, maintains high-frequency performance, and improves moisture resistance, ensuring long-term reliability and reduced electromagnetic interference.
Implementation Method 1
the Cu lid's tunnel structure and exposed areas enhance thermal conductivity
Implementation Method 2
seal an upper portion of a semiconductor chip only with a mold resin, thereby ensuring electrical insulation of the semiconductor chip
Data Source
AI summary
A semiconductor device including a board having a ground electrode and resin layers and a semiconductor chip mounted on the board, includes: a core embedded inside the board such that a front surface thereof is exposed on the front surface side of the board; a filled via provided so as to penetrate the resin layer disposed between the core and the ground electrode, of the resin layers, and electrically connecting a back surface of the core and the ground electrode; a joining material including a lid provided on the board so as to cover the semiconductor chip, having an exposed front surface, and having a high thermal conductivity and sintered silver joining a back surface of the lid and the front surface of the core; and a mold resin transfer-molded on an entirety of the front surface of the board and provided so as to surround the lid.