Semiconductor Package Lid Spacer Structures for Thermal Interface Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating and connecting multiple semiconductor dies on a single interposer structure, leading to issues with thermal management and reliability due to uneven distribution of thermal interface materials and adhesives, which can result in delamination and non-uniform arrangements.
Innovation Solution
The use of spacer structures, such as conductive or polymeric spacers, placed between the circuit substrate and the lid structure, helps in controlling the distance and distribution of thermal interface materials and adhesives, ensuring uniform attachment and preventing squeeze-out and bleeding, thereby enhancing the reliability of the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal interface materials and adhesives are applied without spacer structures, then the application process is simpler, but the distribution becomes non-uniform causing delamination and reliability issues
Solution Approach 1:
Spacer structures are introduced as intermediary elements between the lid structure and circuit substrate to mediate the application of thermal interface materials and adhesives. These spacers act as physical guides that ensure uniform distribution of materials while preventing direct contact between the lid and substrate, thereby eliminating delamination issues without requiring complex application processes.
Solution Approach 2:
The spacer structures are pre-positioned on the circuit substrate before applying thermal interface materials and adhesives. This preliminary placement establishes predetermined uniform distribution patterns that guide subsequent material application, ensuring consistency and preventing non-uniform arrangements before the actual bonding process occurs.
2Reliability
If spacer structures are used to control distance and distribution, then thermal management and reliability improve, but the manufacturing process becomes more complex
Solution Approach 1:
The spacer structures serve as intermediary components that simplify the overall manufacturing process by providing built-in guidance for material application. Rather than requiring complex external fixtures or multi-step alignment procedures, the spacers themselves encode the necessary positioning information, making the manufacturing process more straightforward despite adding a component.
Solution Approach 2:
The spacer structures perform multiple functions simultaneously: they maintain precise distance between lid and substrate, guide uniform distribution of thermal interface materials, position adhesives correctly, and prevent material squeeze-out. This multi-functionality consolidates several manufacturing requirements into a single component, improving reliability while keeping the process manageable.
3Productivity
If multiple semiconductor dies are integrated on a single interposer structure, then packaging efficiency improves, but thermal management becomes more difficult due to uneven thermal interface material distribution
Solution Approach 1:
The use of individual spacer structures for each die placement location segments the thermal interface material application process into discrete, controlled zones. This segmentation ensures that each semiconductor die receives uniform thermal interface material distribution independently, preventing the uneven distribution problems that arise when attempting to cover multiple dies simultaneously without localized control.
Solution Approach 2:
Spacer structures act as intermediary elements that facilitate uniform thermal interface material distribution across multiple semiconductor dies on a single interposer. By providing localized guidance at each die position, the spacers enable efficient multi-die packaging while maintaining consistent thermal contact, thus resolving the thermal management challenges associated with high-density integration.
Data Source
AI summary
A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.