Package Lid With Embedded TEC Cooling for IC Hot Spots
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of impaired thermal performance in semiconductor integrated circuits (ICs) due to localized heat generation at hot spots, which affects performance and reliability, is not adequately addressed by existing technologies.
Innovation Solution
A method involving the fabrication of a lid with an embedded active cooling device directly over the hot spot, using a thermally conductive material and powered thermoelectric coolers (TECs) to dissipate heat radially and vertically from the hot spot, integrated with a package component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC geometry size is decreased to increase functional density, then production efficiency is improved and costs are lowered, but thermal performance is impaired and heat dissipation is hindered
Solution Approach 1:
The patent segments the heat dissipation function by placing multiple discrete thermal via structures at specific hot spot locations rather than using uniform heat dissipation across the entire IC. This allows targeted heat removal from high-density regions while maintaining overall scaling benefits.
Solution Approach 2:
The patent applies local quality by creating specialized thermal via structures with specific dimensions, materials, and configurations at identified hot spot locations. These localized thermal management features have different properties than the surrounding IC structure, optimizing heat dissipation where needed most.
2Quantity of substance
If functional density is increased by scaling down IC components, then more devices fit per chip area, but heat generation becomes localized at certain spots creating hot spots
Solution Approach 1:
The patent extracts the heat dissipation function from the general IC structure by implementing separate, dedicated thermal via structures that are specifically designed to remove heat from hot spot regions. This separates the computational function from the thermal management function.
Solution Approach 2:
The patent introduces thermal via structures as intermediary elements between the IC hot spots and the external environment. These vias act as thermal conduits that mediate heat transfer from the high-density device regions to heat sinks or cooling structures.
3Reliability
If conventional heat dissipation methods are used, then overall thermal management is provided, but localized hot spots are not effectively targeted and dissipated
Solution Approach 1:
The patent employs preliminary action by performing thermal simulations and analyses during the IC design phase to identify potential hot spot locations before fabrication. This allows thermal via structures to be pre-positioned at critical locations, ensuring accurate targeting without requiring post-manufacturing adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by accurately targeting and dissipating heat from localized hot spots, improving performance and reliability of ICs by effectively managing thermal issues.
Implementation Method 1
powered thermoelectric coolers (TECs) to dissipate heat radially and vertically from the hot spot
Implementation Method 2
using a thermally conductive material and powered thermoelectric coolers (TECs) to dissipate heat
Data Source
AI summary
A package structure according to the present disclosure includes a package substrate, a package component disposed over the package substrate, a lid disposed over the package substrate and the package component, and an active cooling device embedded in the lid.