Package Lid Structure for Multi-Die Thermal Dissipation
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in integrating multiple semiconductor devices while addressing the demands for miniaturization, higher speed, and better electrical performance, particularly in terms of transmission and insertion loss, which existing packaging and assembling techniques have not adequately resolved.
Innovation Solution
A semiconductor device structure is developed with a package lid that includes a footing, an island, and ribs, which are designed to enhance thermal dissipation and mechanical stability by creating a concavity over the semiconductor dies, allowing for effective heat exchange and reduced mechanical stress through specific material and structural configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor devices are integrated in a compact form factor, then miniaturization and integration density are improved, but thermal dissipation becomes insufficient and mechanical stress increases
Solution Approach 1:
The package lid is segmented into multiple functional regions: a footing region for mechanical support and stress distribution, an island region for direct thermal contact with the semiconductor die, and rib structures connecting these regions. This segmentation allows each region to specialize in its function while working together to solve both miniaturization and thermal dissipation challenges.
Solution Approach 2:
The package lid transitions from a conventional flat two-dimensional structure to a three-dimensional structure with vertical protrusions (island and ribs). This dimensional change creates additional thermal pathways and mechanical support structures within the compact form factor, enabling improved heat dissipation and stress management without increasing the horizontal footprint.
2Volume of moving object
If multiple semiconductor devices are integrated in a compact form factor, then miniaturization and integration density are improved, but resistance to mechanical stress decreases
Solution Approach 1:
The package lid is divided into a footing region that provides broad mechanical support and an island region that directly contacts the die, connected by rib structures. This segmentation allows the footing to handle macro-scale mechanical stresses while the ribs transmit and distribute these stresses, preventing concentration at critical interfaces.
Solution Approach 2:
The package lid is constructed from a thermally conductive material that also provides mechanical strength, creating a composite structure that simultaneously addresses thermal management and mechanical stress resistance. The material composition is optimized to balance thermal conductivity with structural integrity in the compact form factor.
3Ease of manufacture
If conventional packaging techniques are used, then manufacturing simplicity is maintained, but transmission loss and insertion loss performance are insufficient
Solution Approach 1:
The package lid implements local quality by creating distinct regions with different functional properties: the island region provides direct thermal and mechanical contact with the die, the footing region provides broad support, and the ribs provide structural reinforcement. This localized functional differentiation improves electrical performance through better thermal management and stress control without requiring complete redesign of the entire packaging system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal dissipation and increased resistance to mechanical stress, improving the performance and reliability of semiconductor devices by optimizing the integration of multiple dies within a compact form factor.
Implementation Method 1
A semiconductor device includes a first semiconductor die, a thermal interface material, and a package lid. The thermal interface material is disposed on the first semiconductor die... the package lid contacts the thermal interface material on the first semiconductor die
Implementation Method 2
The package lid contacts the thermal interface material on the first semiconductor die... providing enhanced thermal dissipation
Data Source
AI summary
A semiconductor device includes a package lid. The package lid includes a roof, an island and a footing. The roof extends along a first direction and a second direction perpendicular to the first direction and includes a first portion and a second portion. The island protrudes from the first portion of the roof. The footing is disposed at a peripheral edge of the roof and protrudes from the roof along a third direction perpendicular to the first direction and the second direction, wherein the island is disconnected from the footing along the second direction, and the island is physically connected to the footing along the first direction.