Semiconductor Package Lid Structure for Warpage and Heat Dissipation
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Solution Overview
Problem
Existing flip-chip package structures face challenges with package warpage and thermal dissipation due to complex fabrication processes, which affect the miniaturization, high-speed operation, and functionality of electronic products.
Innovation Solution
A semiconductor package structure featuring a ring-type or cap-type lid structure with openings and recesses that enhance structural strength and thermal dissipation by allowing direct contact between heat sinks and semiconductor dies, while also reducing manufacturing costs through design flexibility and simplified fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a complex fabrication process is used to achieve miniaturization and multi-functionality, then device functionality and size are improved, but package warpage and thermal dissipation issues worsen
Solution Approach 1:
The lid structure is segmented into multiple functional zones: a first region with a first thickness and a second region with a second thickness different from the first. This segmentation allows different portions of the lid to serve different functions - one region provides structural support while another enables thermal dissipation or electrical connection, thereby achieving multi-functionality without requiring complex fabrication processes
Solution Approach 2:
The lid structure implements local quality by having different thicknesses in different regions. The first region has a first thickness optimized for one function (e.g., structural support), while the second region has a second thickness optimized for another function (e.g., thermal dissipation). This local differentiation enables the single lid structure to perform multiple functions simultaneously, reducing the need for complex multi-component assemblies
2Volume of moving object
If fabrication complexity increases to achieve miniaturization, then device size and functionality are improved, but manufacturing cost and fabrication difficulty worsen
Solution Approach 1:
The lid is divided into a first region and a second region with different thicknesses, allowing each region to be optimized for its specific function. This segmentation enables the creation of a compact, multi-functional structure that can be fabricated using standard semiconductor manufacturing techniques without requiring overly complex processes
Solution Approach 2:
The lid structure serves multiple functions through its multi-region design: structural support, thermal dissipation, and electrical connection capabilities. By integrating these functions into a single lid component rather than requiring multiple separate components, the overall package size is reduced while maintaining ease of manufacture
3Ease of manufacture
If existing package structures are used, then manufacturing simplicity is maintained, but thermal dissipation performance worsens
Solution Approach 1:
The lid structure implements local quality by creating a second region with a second thickness that is different from the first thickness. This localized thickness variation enables enhanced thermal dissipation in the second region while maintaining the structural integrity provided by the first region, all within a single-fabrication-process framework
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively prevents package warpage and improves thermal dissipation, maintaining high structural integrity and performance in compact electronic devices.
Implementation Method 1
allowing direct contact between heat sinks and semiconductor dies, improving thermal dissipation
Data Source
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AI summary
A semiconductor package structure including a package substrate, at least one semiconductor die, a lid structure, a first electronic component and a heat sink is provided. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is on the first surface of the package substrate and is surrounded by an encapsulating layer. The lid structure surrounds and is spaced apart from the encapsulating layer. The lid structure includes a first opening that is covered by the first surface of the package substrate. The first electronic component is over the first surface of the package substrate and arranged within the first opening of the lid structure. The heat sink covers the lid structure and the semiconductor die.