Semiconductor Package Connection Lug Layout for High-Voltage Clearance
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Solution Overview
Problem
High voltage semiconductor devices in densely packed arrangements face challenges due to constraints on lead spacing and footprint caused by industry-defined creepage and clearance requirements, leading to design complexities in power connections and board space utilization.
Innovation Solution
A semiconductor package design where a connection lug is positioned on one side of the encapsulant body opposite to the package leads, allowing for increased creepage and clearance distances, and enabling power and reference potential distribution in separate vertical planes, with the connection lug serving as one load terminal and package leads serving as the other, facilitating efficient power connections and reduced board space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple discrete power semiconductor packages are arranged in a densely packed arrangement to accommodate power loads, then the power handling capability is improved, but the board space required increases due to creepage and clearance requirements
Solution Approach 1:
The patent moves the high voltage connection lug from the same plane as the low voltage leads to an opposite side of the encapsulant body, effectively utilizing the third dimension (depth/thickness) of the package. This spatial reconfiguration allows creepage and clearance paths to extend through the encapsulant body rather than being constrained to a two-dimensional plane, thereby reducing the board footprint required for densely packed arrangements while maintaining high voltage isolation requirements
2Area of stationary object
If lead spacing is reduced to minimize board space, then the board space usage is improved, but the creepage and clearance distances are compromised leading to electrical breakdown risks
Solution Approach 1:
By positioning the connection lug on the opposite side of the encapsulant body from the leads, the patent creates a three-dimensional creepage and clearance path that extends through the encapsulant material. This dimensional transition ensures that even when leads are closely spaced on the board, the high voltage isolation distances are maintained through the package structure itself, preventing electrical breakdown while enabling compact board layouts
Solution Approach 2:
The encapsulant body acts as an intermediary medium that provides the required creepage and clearance distances between the leads extending from one side and the connection lug extending from the opposite side. This intermediary structure ensures electrical isolation is maintained through the package material, allowing reduced lead spacing on the board without compromising reliability
3Ease of manufacture
If through-hole type leads are arranged in a row extending from one side of the package, then the manufacturing simplicity is improved, but the power connection complexity increases due to congested routing areas
Solution Approach 1:
The patent resolves power connection complexity by separating high voltage and low voltage connections into different spatial zones: leads extending from one side of the encapsulant body and the connection lug extending from the opposite side. This dimensional separation distributes power connections across different areas of the board, eliminating congested routing zones and simplifying overall power distribution architecture while maintaining straightforward manufacturing processes
Data Source
AI summary
A method includes providing a first lead frame that includes a first die pad and a first row of leads, providing a connection lug, mounting a first semiconductor die on the first die pad, the first semiconductor die including first and second voltage blocking terminals, electrically connecting the connection lug to one of the first and second voltage blocking terminals, electrically connecting a first one of the leads from the first row to an opposite one of the first and second voltage blocking terminals, and forming an encapsulant body of electrically insulating material that encapsulates first die pad and the first semiconductor die. After forming the encapsulant body, the first row of leads each protrude out of a first outer face of the encapsulant body and the connection lug protrudes out of a second outer face of the encapsulant body.