Semiconductor Package Shielding for External Magnetic Field Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetic devices such as MRAMs are sensitive to external magnetic fields, which can cause anomalies, malfunctioning, and damage by altering magnetization and polarity, leading to issues with memory storage and device operation.
Innovation Solution
A package structure incorporating magnetic field shieldings, including upper, lateral, and lower magnetic field shieldings made of paramagnetic, ferromagnetic, or high permeability materials, is designed to mitigate the effects of external magnetic fields by providing a lower reluctance path for magnetic flux, thereby protecting the magnetic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic field shieldings are added to protect magnetic devices from external magnetic fields, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent implements magnetic field shieldings in a nested configuration where upper, lateral, and lower shieldings are positioned to form concentric protective layers around the magnetic device. The lateral shielding is disposed between the upper and lower shieldings, creating a nested structure that provides comprehensive magnetic field protection while optimizing space utilization and reducing overall package complexity.
Solution Approach 2:
The lateral magnetic field shielding acts as an intermediary element that bridges the upper and lower shieldings. This intermediate component provides continuous magnetic field protection by connecting the top and bottom protective layers, ensuring that magnetic flux is redirected away from the magnetic device from all directions while maintaining structural integrity.
2Reliability
If multiple magnetic field shieldings (upper, lateral, lower) are implemented, then protection effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic field protection system is segmented into three distinct components: upper magnetic field shielding, lateral magnetic field shielding, and lower magnetic field shielding. Each segment is designed and fabricated separately using standard semiconductor manufacturing processes, allowing for independent optimization and assembly. This segmentation enables flexible integration into existing manufacturing workflows while maintaining comprehensive protection coverage.
3Reliability
If magnetic field shieldings are added around the magnetic device, then protection is improved, but the package size increases
Solution Approach 1:
The magnetic field shieldings are strategically positioned to provide protection only in the specific regions where magnetic devices are located. The upper shielding covers the top surface, the lower shielding covers the bottom surface, and the lateral shielding provides side protection, creating localized protective zones that minimize unnecessary material usage and package volume expansion while ensuring comprehensive magnetic field protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic field shieldings effectively reduce the impact of external magnetic fields on magnetic devices, preventing anomalies, malfunctions, and damage, while also enhancing the mechanical strength and miniaturization of the package structure.
Implementation Method 1
A package structure incorporating magnetic field shieldings, including upper, lateral, and lower magnetic field shieldings made of paramagnetic, ferromagnetic, or high permeability materials, is designed to mitigate the effects of external magnetic fields by providing a lower reluctance path for magnetic flux
Data Source
AI summary
The present disclosure provides a package structure, including a mounting pad having a mounting surface, a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip includes a first surface, a second surface opposite to the first surface and facing the mounting surface, and a third surface connecting the first surface and the second surface, a first magnetic field shielding, including a first portion proximal to the third surface of the semiconductor chip, wherein the first portion has a first height calculated from the mounting surface to a top surface, and a second portion distal to the semiconductor chip, has a second height calculated from the mounting surface to a position at a surface facing away from the mounting surface, wherein the second height is less than the first height, wherein the second portion has an inclined sidewall.