Semiconductor Package Dual Marking for Heatsink-Obscured IDs
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently marking product information due to limited surface area, with existing markings being obscured by heatsinks or adhesive materials, making it difficult to read the product tracking and identity information.
Innovation Solution
The semiconductor package employs two product markings on the same side but on different materials – one on the metallic area and the other on the plastic molding – allowing for alternative information retrieval even if the first marking is obscured by a heatsink or adhesive, using alphanumeric characters or two-dimensional matrices formed through indentations, protrusions, or laser marking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a single product marking is placed on the metallic area, then the marking can be clearly visible, but it becomes obscured when a heatsink is attached with adhesive material
Solution Approach 1:
The patent applies local quality by placing product markings on two different locations with different properties: one marking on the metallic area (which may be obscured) and another marking on the plastic molding (which remains visible). This ensures that at least one marking remains accessible for reading regardless of heatsink attachment.
Solution Approach 2:
The patent creates a copy of the product marking information in two different locations on the package. The same product identification information is marked both on the metallic area and on the plastic molding, so that if one marking is obscured, the other serves as a backup copy that can be read.
2Loss of information
If more product information is marked on the package, then better traceability is achieved, but the limited surface area restricts the amount of information that can be displayed
Solution Approach 1:
The patent utilizes another dimension by marking product information on two different surfaces of the package: the metallic area and the plastic molding. This spatial distribution across different surfaces effectively increases the available marking area without requiring a larger single surface.
Solution Approach 2:
The patent segments the marking function by dividing the product information display across two separate locations on the package. Instead of concentrating all markings on one surface, the information is segmented between the metallic area marking and the plastic molding marking, allowing comprehensive information display within limited space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that product information can be reliably inferred from either marking, enhancing readability and traceability, especially when heatsinks are attached or removed, and facilitating automatic recognition systems.
Implementation Method 1
The laser beam is directed over the outer surface of the metallic area and the outer surface of the plastic molding, removing portions of each to provide a data matrix in each outer surface
Data Source
Figure 1A~1D
Figure 1E
Figure 2
AI summary
In an embodiment, a semiconductor package 10, 100 is provided that comprises a first package surface 11 and a second package surface 12 opposing the first surface 11, a plastic molding 13 and one or more semiconductor dies 14. The first package surface 11 comprises a first surface 15 of the plastic molding 13 and a first metallic area 16 exposed from the plastic molding 13. The first metallic area 16 comprises a first product marking 17 comprising at least one alphanumeric character and the first surface 15 of the plastic molding 13 comprises a second product marking 18 comprising at least one alphanumeric character.